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EMC, Arlon Industry Leading PWB Laminates at DesignCon 2024
January 29, 2024 | EMCEstimated reading time: 1 minute
At the DesignCon 2024 Expo, drop by EMC/ Arlon booth #1260 and learn from the experts with the results from a wide range of performance testing that some of our key OEM customers in almost all market segments of technology, have completed. Our EM-892K products continue to gain wide acceptance within the AI Server and 800G switch market spaces. We are on track to also introduce our EM-896K3 which will offer even higher speed/low loss solutions including for the 224 Gbps PAM4 product requirements.
EMC has also added another high-speed/low loss solution for Automotive Sector laminate needs. We have introduced the EM-A56 for next generation ADAS implementations designed with 3.2 Dk/0.004 Df along with its enhanced very low Z axis CTE of 1.8% with material samples currently available for testing. Additionally, we are introducing EM-A30 with a low Z-axis CTE of 1.7% that will also have a UL Comparative Tracking Index of ‘1’, that will be ideal for very high voltage electronics for automotive and industrial applications.
For Automotive and 5G/Antenna applications, we are introducing EM-A70/EM-A70K which is a lower cost non-PTFE based system that provides more cost-effective solutions for antenna applications.
For dedicated mission critical PWB’s for military, aerospace, down hole oil and gas drilling, burn-in and automatic test equipment, Arlon has introduced 86HP as the revolutionary addition to Arlon’s best-in-class high performance polyimide laminate systems engineered to meet high temperature, electrical and mechanical performance not found with any other polyimide resin system. 86HP also meets IPC-4101 slash sheets 40 and 41.
86HP is designed for dense circuit configurations due to the Anti-CAF performance of over 1,000 hours at 85% RH/85⁰C/ 100V DC, low-Z-axis expansion of <1% between 50⁰C to 260⁰C for high layer count MLB’s, very high decomposition temperatures of 430⁰C, high thermal conductivity of 0.6 W/mK, low moisture uptake of 0.12% for sensitive climate applications and is ideal for sequential lamination designs requiring up to seven additional lamination steps.
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CACI Awarded $1.3 Billion Task Order to Provide Communications and Information Technology Expertise
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Cadence Unveils Palladium Z3 and Protium X3 Systems
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IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
Northrop Grumman Honors Calumet Electronics with Supplier Excellence Award
04/17/2024 | Calumet ElectronicsNorthrop Grumman Corporation has recognized Calumet Electronics during the company’s 2024 Supplier Excellence Awards for “exceptional performance and unwavering commitment to delivering with excellence.” Calumet is one of 70 suppliers recognized from across the globe. In its award category of “Supplier Strategic Excellence,” Calumet was honored alongside global corporations such as Amazon Web Services, Dell Technologies, and Eaton Corporation.