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EMC, Arlon Industry Leading PWB Laminates at DesignCon 2024
January 29, 2024 | EMCEstimated reading time: 1 minute
At the DesignCon 2024 Expo, drop by EMC/ Arlon booth #1260 and learn from the experts with the results from a wide range of performance testing that some of our key OEM customers in almost all market segments of technology, have completed. Our EM-892K products continue to gain wide acceptance within the AI Server and 800G switch market spaces. We are on track to also introduce our EM-896K3 which will offer even higher speed/low loss solutions including for the 224 Gbps PAM4 product requirements.
EMC has also added another high-speed/low loss solution for Automotive Sector laminate needs. We have introduced the EM-A56 for next generation ADAS implementations designed with 3.2 Dk/0.004 Df along with its enhanced very low Z axis CTE of 1.8% with material samples currently available for testing. Additionally, we are introducing EM-A30 with a low Z-axis CTE of 1.7% that will also have a UL Comparative Tracking Index of ‘1’, that will be ideal for very high voltage electronics for automotive and industrial applications.
For Automotive and 5G/Antenna applications, we are introducing EM-A70/EM-A70K which is a lower cost non-PTFE based system that provides more cost-effective solutions for antenna applications.
For dedicated mission critical PWB’s for military, aerospace, down hole oil and gas drilling, burn-in and automatic test equipment, Arlon has introduced 86HP as the revolutionary addition to Arlon’s best-in-class high performance polyimide laminate systems engineered to meet high temperature, electrical and mechanical performance not found with any other polyimide resin system. 86HP also meets IPC-4101 slash sheets 40 and 41.
86HP is designed for dense circuit configurations due to the Anti-CAF performance of over 1,000 hours at 85% RH/85⁰C/ 100V DC, low-Z-axis expansion of <1% between 50⁰C to 260⁰C for high layer count MLB’s, very high decomposition temperatures of 430⁰C, high thermal conductivity of 0.6 W/mK, low moisture uptake of 0.12% for sensitive climate applications and is ideal for sequential lamination designs requiring up to seven additional lamination steps.
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