It’s Only Common Sense: We Have Met the Enemy, and It’s Us
Dan’s Biz Bookshelf: ‘Super Performance: 8 Strategies to Reach Full Potential’
Happy’s Tech Talk #45: Designing the Smart Factory 
EMC, Arlon Industry Leading PWB Laminates at DesignCon 2024
January 29, 2024 | EMCEstimated reading time: 1 minute
At the DesignCon 2024 Expo, drop by EMC/ Arlon booth #1260 and learn from the experts with the results from a wide range of performance testing that some of our key OEM customers in almost all market segments of technology, have completed. Our EM-892K products continue to gain wide acceptance within the AI Server and 800G switch market spaces. We are on track to also introduce our EM-896K3 which will offer even higher speed/low loss solutions including for the 224 Gbps PAM4 product requirements.
EMC has also added another high-speed/low loss solution for Automotive Sector laminate needs. We have introduced the EM-A56 for next generation ADAS implementations designed with 3.2 Dk/0.004 Df along with its enhanced very low Z axis CTE of 1.8% with material samples currently available for testing. Additionally, we are introducing EM-A30 with a low Z-axis CTE of 1.7% that will also have a UL Comparative Tracking Index of ‘1’, that will be ideal for very high voltage electronics for automotive and industrial applications.
For Automotive and 5G/Antenna applications, we are introducing EM-A70/EM-A70K which is a lower cost non-PTFE based system that provides more cost-effective solutions for antenna applications.
For dedicated mission critical PWB’s for military, aerospace, down hole oil and gas drilling, burn-in and automatic test equipment, Arlon has introduced 86HP as the revolutionary addition to Arlon’s best-in-class high performance polyimide laminate systems engineered to meet high temperature, electrical and mechanical performance not found with any other polyimide resin system. 86HP also meets IPC-4101 slash sheets 40 and 41.
86HP is designed for dense circuit configurations due to the Anti-CAF performance of over 1,000 hours at 85% RH/85⁰C/ 100V DC, low-Z-axis expansion of <1% between 50⁰C to 260⁰C for high layer count MLB’s, very high decomposition temperatures of 430⁰C, high thermal conductivity of 0.6 W/mK, low moisture uptake of 0.12% for sensitive climate applications and is ideal for sequential lamination designs requiring up to seven additional lamination steps.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Symposium Review: A Glimpse Into the Future of IC Substrates and Beyond
01/19/2026 | Edy Yu, Editor-in-Chief, ECIOThe Hong Kong Printed Circuit Association (HKPCA) and the Korea Printed Circuit Association (KPCA), with strong support from SEMI, presented “The Future of IC Substrates and Beyond Symposium 2025” at the Sands Expo and Convention Centre in Singapore in . The event brought together elite professionals, technical experts, and corporate leaders from across the global IC substrate industry chain to explore cutting-edge trends and innovative solutions shaping the future of the sector.
Powering the Future: The Materials That Make Tomorrow Possible
01/14/2026 | Brian Buyea -- Column: Powering the FutureAt Remtec, we live in the intersection where science meets manufacturability, and where reliability isn’t a promise but a measurable outcome. “Powering the Future” isn’t just a slogan. It’s the challenge we face daily as engineers designing metallized ceramic substrates, power packages, and thermal solutions that quietly enable the technologies shaping our world.
Dan’s Biz Bookshelf: ‘Super Performance: 8 Strategies to Reach Full Potential’
01/15/2026 | Dan Beaulieu -- Column: Dan's Biz BookshelfOnce in a while, a book comes along that doesn’t just inspire; it instructs. George Pesansky’s "Super Performance: 8 Strategies to Reach Full Potential for Yourself, Your Team, and Your Organization" is a rare gem that’s neither a theory, fluff, nor another feel-good leadership manual. It’s a roadmap for anyone serious about unlocking their full potential and that of those around them.
UHDI Fundamentals: An Overview of UHDI Layer Types
01/02/2026 | Anaya Vardya, American Standard CircuitsUHDI layer types include core, sequential lamination build-up; microvia; embedded and passive antennas and inductors; and embedded functional, protective, and hybrid rigid-flex layers. Together, they enable ultra-fine features, dense interconnects, high-frequency performance, and miniaturized system designs. UHDI typically requires multiple SBU cycles, where thin dielectric and copper layers are drilled for microvias, plated, imaged, and laminated sequentially to build up to the final design from the inside out.
Global Electronics Association Releases Q4 Standards and Revisions Update
12/24/2025 | Global Electronics AssociationEach quarter, the Global Electronics Association releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit electronics.org/ipc-standards. These are the latest releases for Q4 2025.