Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

KIC Launches Game-Changing TAS Software Platform to Address Emerging Thermal Process Challenges

11/14/2024 | KIC
KIC, the leader in smart thermal process technologies for electronics manufacturing, announces the launch of its TAS Software (Thermal Analysis System Software), an advanced solution designed to tackle new industry challenges and provide fresh opportunities in thermal profiling.

Renesas Unveils Industry’s First Automotive Multi-Domain SoC Built with 3-nm Process Technology

11/13/2024 | Renesas
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, launched the new generation of automotive fusion system-on-chips (SoCs), serving multiple automotive domains including Advanced Driver Assistance Systems (ADAS), in-vehicle infotainment (IVI), and gateway applications on a single-chip.

Jabil and Cyferd Unveil ID8 Global, a Joint Venture Launching Groundbreaking AI-Driven, Fully Autonomous Supply Chain Platform

11/12/2024 | Jabil
Jabil Inc., a global leader in engineering, manufacturing, and supply chain solutions today announced ID8 Global, a joint venture with Cyferd Inc., a pioneering AI company specializing in data technology.

Empower Semiconductor Showcases Cutting-Edge Vertical Power Architecture for AI and HPC Processors at electronica 2024

11/06/2024 | Empower Semiconductor
Empower Semiconductor, the world leader in integrated voltage regulators (IVRs), will demonstrate its new Crescendo platform with FinFast™ technology at electronica 2024, the world’s leading trade fair and conference for electronics.

AMD and Fujitsu to Begin Strategic Partnership to Accelerate Open-Source AI Initiatives

11/01/2024 | AMD
AMD and Fujitsu Limited today announced that they have signed a memorandum of understanding (MOU) to form a strategic partnership to create computing platforms for AI and high-performance computing (HPC). The partnership, encompassing aspects from technology development to commercialization, will seek to facilitate the creation of open source and energy efficient platforms comprised of advanced processors with superior power performance and highly flexible AI/HPC software and aims to accelerate open-source AI and/or HPC initiatives.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in