Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

IBM, Visionbay.ai to Accelerate the Next Era of AI Across Asia Pacific

07/29/2026 | Foxconn
IBM and Visionbay.ai – backed by Hon Hai Technology Group (Foxconn) — announced a collaboration to develop an AI platform and expand Visionbay’s AI App Store for enterprises and regulated industries across Asia Pacific.

Intel, Google Cloud Announce Collaboration to Accelerate Intel’s AI-Enabled Enterprise Transformation

07/21/2026 | Intel Corporation
Intel and Google Cloud announced an expansion of their previously announced multi-year strategic collaboration, which would accelerate Intel’s enterprise-wide digital evolution through the deployment of Gemini Enterprise and Google Cloud.

ERP, Automation, and Maturity: A Systems Framework for Manufacturers

07/08/2026 | Scott Ryan, Cetec ERP
One unique opportunity for ERP consultants is to see how manufacturers operate. They can see how businesses adopt, stretch, patch, or replace systems to manage growth, customer requirements, inefficiency, or pressure on the bottom line. The insight is important to what business maturity looks like. ERP matters because it becomes the foundation for shared processes and data. It organizes how information moves, departments interact, work is measured, and how well an SMB manufacturer can scale.

Interlocking Material Management and Quality

07/01/2026 | Nolan Johnson, SMT007 Magazine
Cogiscan’s Greg Benoit recently published a white paper series on material tracking in the EMS sector, in which he argues that achieving a fully integrated MES infrastructure requires more than a software package to make the system work at its best. In this interview, Greg discusses the white paper series in more depth. You can download the two-part Cogiscan white paper, Strategies for Efficient Material Management in Circuit Board Assembly, from our Industry Resource Center.

U.S. Semiconductor Firms Innovate to Meet AI-Driven Demand

06/23/2026 | BUSINESS WIRE
U.S. semiconductor companies are accelerating investments in AI-focused chip development, advanced packaging technologies and new supply chain strategies as semiconductors become increasingly critical to digital transformation and economic competitiveness, according to a new research report published by Information Services Group (ISG), a global AI-centered technology research and advisory firm.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in