Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Cetec ERP, Boardera Announce Integration Partnership for Faster PCB Assembly Quoting

09/28/2026 | Cetec ERP
Cetec ERP and Boardera Software Inc. have announced an integration partnership designed to help electronics manufacturing services (EMS) and contract manufacturing companies move more efficiently from incoming RFQ to production-ready quote.

North American Demand to Drive Enterprise SSD Price Gains in 4Q26

09/21/2026 | TrendForce
U.S. CSPs have recently upgraded their enterprise SSD demand forecasts over the past two weeks, according to TrendForce’s research.

CoWoS-L to Remain Mainstream AI Chip Packaging Solution Through 2028

09/18/2026 | TrendForce
TrendForce’s latest research into advanced semiconductor packaging reveals that GPU suppliers and hyperscale CSPs are continuing to develop increasingly powerful and versatile AI chips, making larger package sizes a key development priority for 2.5D packaging.

Gartner Forecasts Worldwide AI Spending to Grow 49.5% in 2026

09/17/2026 | Gartner, Inc.
Worldwide spending on AI is forecast to total $2.7 trillion in 2026, a 49.5% increase year-over-year, according to Gartner, Inc., a business and technology insights company.

India’s Tablet Market Rises 3.4% YoY in Q2 2026 to 1.1 Million Units

09/02/2026 | IDC
India’s tablet market shipped 1.1 million units in Q2 2026, up 3.4% year-over-year (YoY), according to the latest data from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in