- 
                                  
- 
                            News
                        News Highlights
-  Books
                        Featured Books
- smt007 Magazine
Latest IssuesCurrent Issue  Production Software IntegrationEMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?   Spotlight on IndiaWe invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.   Supply Chain StrategiesA successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception. 
- Articles
- Columns
- Links
- Media kit||| MENU
- smt007 Magazine
ViTrox Sets to Showcase Innovation at the 2024 SMTA Wafer-Level Packaging Symposium
February 2, 2024 | ViTroxEstimated reading time: 2 minutes
ViTrox, which aims to be the World’s Most Trusted Technology Company, is pleased to announce its participation in the 2024 SMTA Wafer-Level Packaging Symposium at tabletop #1 in the Hyatt Regency San Francisco Airport from 13th to 14th February 2024.
ViTrox is set to showcase its latest technological advancements, highlighting its dedication to meeting the evolving needs of the industries. The cutting-edge solutions to be unveiled during the show range from PX730i Die Sorting, Inspection & Package Solution, Wi8i Wafer Vision Inspection Handler, SMT PCBA Vision Inspection Solutions (SPI, AOI, AXI, ARV), and the Industry 4.0 Manufacturing Intelligence Solutions (V-ONE).
ViTrox's PX730i is an advanced solution tailored for die sorting, comprehensive 6-sided inspection, and efficient tape & reel packaging. Specifically designed to supersede traditional human visual inspection methods, this system boasts a high-speed waffle-to-tape and reel inspection capability and a high-accuracy vision inspection system to ensure optimal efficiency and accuracy in manufacturing. Additionally, Wi8i Wafer Vision Inspection Handler is designed to support 2D surface defect inspections and metrology for a variety of wafer forms, including raw wafers, hoop ring wafers, and framed wafers, ranging from 100 mm (4") to 300 mm (12"). The wafer vision inspection handler has various handling mechanisms to replace conventional manual visual inspection while offering reliable, repeatable, reproducible inspection results.
The V310i 3D SPI provides effortless programming while achieving excellent repeatability and accurate inspection results. Equipped with Ultra Smart Programming, users can instantly start inspection without manual parameter setup, making it user-friendly even for inexperienced operators. Next will be the V510i 3D AOI solution, which is well-implemented with in-depth Artificial Intelligence (A.I.) Smart Technologies. With A.I. Smart Programming, our AOI can reduce human dependency, rapidly improve the programming speed, and guarantee quality, accuracy, and consistency during inspections. Additionally, by incorporating new machine geometry and scanning methods, V810i 3D AXI boosts inspection speed by up to 30%. Equipped with A.I. integration, our AXI possesses the capability to detect defects of specific joint types with enhanced inspection accuracy.
Our award-winning V9i Advanced Robotic Vision (ARV) Solution revolutionizes flexible inspections for conformal coating and final assembly inspections. With its Advanced Smart Learning Algorithm, V9i ARV detects various conformal coating defects and checks for screw, cosmetic, connector, and label defects in final assembly without requiring CAD information. Last but not least, our cutting-edge Industry 4.0 Manufacturing Intelligence Solutions - V-ONE, a Smart Manufacturing ensures connectivity within the production line, accurate data analytics visualization and adept reactivity in Machine-2-Machine (M2M) production.
“We are thrilled to share our latest inspection solutions during the show. ViTrox’s cutting-edge technologies represent our commitment to delivering the highest standards of quality and productivity to our customers,” said Richard Osborne, Sr. General Manager of the U.S. and Canada.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Real Time with... SMTAI 2025: Koh Young's Innovations in SMT Inspection Technology
10/30/2025 | Real Time with...SMTAIJoel Scutchfield discusses his background as well as Koh Young's advancements in inspection technology. The conversation covers various inspection systems, including the flagship Zenith 2 system and recent software upgrades.
Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
10/28/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany.
New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
10/22/2025 | I-Connect007In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
                                         Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
                                         Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control





 
                     
                 
                    