-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
ViTrox Sets to Showcase Innovation at the 2024 SMTA Wafer-Level Packaging Symposium
February 2, 2024 | ViTroxEstimated reading time: 2 minutes
ViTrox, which aims to be the World’s Most Trusted Technology Company, is pleased to announce its participation in the 2024 SMTA Wafer-Level Packaging Symposium at tabletop #1 in the Hyatt Regency San Francisco Airport from 13th to 14th February 2024.
ViTrox is set to showcase its latest technological advancements, highlighting its dedication to meeting the evolving needs of the industries. The cutting-edge solutions to be unveiled during the show range from PX730i Die Sorting, Inspection & Package Solution, Wi8i Wafer Vision Inspection Handler, SMT PCBA Vision Inspection Solutions (SPI, AOI, AXI, ARV), and the Industry 4.0 Manufacturing Intelligence Solutions (V-ONE).
ViTrox's PX730i is an advanced solution tailored for die sorting, comprehensive 6-sided inspection, and efficient tape & reel packaging. Specifically designed to supersede traditional human visual inspection methods, this system boasts a high-speed waffle-to-tape and reel inspection capability and a high-accuracy vision inspection system to ensure optimal efficiency and accuracy in manufacturing. Additionally, Wi8i Wafer Vision Inspection Handler is designed to support 2D surface defect inspections and metrology for a variety of wafer forms, including raw wafers, hoop ring wafers, and framed wafers, ranging from 100 mm (4") to 300 mm (12"). The wafer vision inspection handler has various handling mechanisms to replace conventional manual visual inspection while offering reliable, repeatable, reproducible inspection results.
The V310i 3D SPI provides effortless programming while achieving excellent repeatability and accurate inspection results. Equipped with Ultra Smart Programming, users can instantly start inspection without manual parameter setup, making it user-friendly even for inexperienced operators. Next will be the V510i 3D AOI solution, which is well-implemented with in-depth Artificial Intelligence (A.I.) Smart Technologies. With A.I. Smart Programming, our AOI can reduce human dependency, rapidly improve the programming speed, and guarantee quality, accuracy, and consistency during inspections. Additionally, by incorporating new machine geometry and scanning methods, V810i 3D AXI boosts inspection speed by up to 30%. Equipped with A.I. integration, our AXI possesses the capability to detect defects of specific joint types with enhanced inspection accuracy.
Our award-winning V9i Advanced Robotic Vision (ARV) Solution revolutionizes flexible inspections for conformal coating and final assembly inspections. With its Advanced Smart Learning Algorithm, V9i ARV detects various conformal coating defects and checks for screw, cosmetic, connector, and label defects in final assembly without requiring CAD information. Last but not least, our cutting-edge Industry 4.0 Manufacturing Intelligence Solutions - V-ONE, a Smart Manufacturing ensures connectivity within the production line, accurate data analytics visualization and adept reactivity in Machine-2-Machine (M2M) production.
“We are thrilled to share our latest inspection solutions during the show. ViTrox’s cutting-edge technologies represent our commitment to delivering the highest standards of quality and productivity to our customers,” said Richard Osborne, Sr. General Manager of the U.S. and Canada.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
Arc-Tronics Strengthens Inspection Capabilities with Three New Saki AOI Systems
09/26/2025 | Saki America,Saki America, Inc., an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce that Arc-Tronics, Inc., a high-reliability EMS provider based in Elk Grove Village, Illinois, has recently installed three 3Di-LS3 Series Automated Optical Inspection (AOI) systems in its production facility.