-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
ViTrox Sets to Showcase Innovation at the 2024 SMTA Wafer-Level Packaging Symposium
February 2, 2024 | ViTroxEstimated reading time: 2 minutes
ViTrox, which aims to be the World’s Most Trusted Technology Company, is pleased to announce its participation in the 2024 SMTA Wafer-Level Packaging Symposium at tabletop #1 in the Hyatt Regency San Francisco Airport from 13th to 14th February 2024.
ViTrox is set to showcase its latest technological advancements, highlighting its dedication to meeting the evolving needs of the industries. The cutting-edge solutions to be unveiled during the show range from PX730i Die Sorting, Inspection & Package Solution, Wi8i Wafer Vision Inspection Handler, SMT PCBA Vision Inspection Solutions (SPI, AOI, AXI, ARV), and the Industry 4.0 Manufacturing Intelligence Solutions (V-ONE).
ViTrox's PX730i is an advanced solution tailored for die sorting, comprehensive 6-sided inspection, and efficient tape & reel packaging. Specifically designed to supersede traditional human visual inspection methods, this system boasts a high-speed waffle-to-tape and reel inspection capability and a high-accuracy vision inspection system to ensure optimal efficiency and accuracy in manufacturing. Additionally, Wi8i Wafer Vision Inspection Handler is designed to support 2D surface defect inspections and metrology for a variety of wafer forms, including raw wafers, hoop ring wafers, and framed wafers, ranging from 100 mm (4") to 300 mm (12"). The wafer vision inspection handler has various handling mechanisms to replace conventional manual visual inspection while offering reliable, repeatable, reproducible inspection results.
The V310i 3D SPI provides effortless programming while achieving excellent repeatability and accurate inspection results. Equipped with Ultra Smart Programming, users can instantly start inspection without manual parameter setup, making it user-friendly even for inexperienced operators. Next will be the V510i 3D AOI solution, which is well-implemented with in-depth Artificial Intelligence (A.I.) Smart Technologies. With A.I. Smart Programming, our AOI can reduce human dependency, rapidly improve the programming speed, and guarantee quality, accuracy, and consistency during inspections. Additionally, by incorporating new machine geometry and scanning methods, V810i 3D AXI boosts inspection speed by up to 30%. Equipped with A.I. integration, our AXI possesses the capability to detect defects of specific joint types with enhanced inspection accuracy.
Our award-winning V9i Advanced Robotic Vision (ARV) Solution revolutionizes flexible inspections for conformal coating and final assembly inspections. With its Advanced Smart Learning Algorithm, V9i ARV detects various conformal coating defects and checks for screw, cosmetic, connector, and label defects in final assembly without requiring CAD information. Last but not least, our cutting-edge Industry 4.0 Manufacturing Intelligence Solutions - V-ONE, a Smart Manufacturing ensures connectivity within the production line, accurate data analytics visualization and adept reactivity in Machine-2-Machine (M2M) production.
“We are thrilled to share our latest inspection solutions during the show. ViTrox’s cutting-edge technologies represent our commitment to delivering the highest standards of quality and productivity to our customers,” said Richard Osborne, Sr. General Manager of the U.S. and Canada.
Suggested Items
IKT Electronics Chooses TRI's X-ray Technology
01/13/2025 | TRIIKT Electronics, a leader in innovative electronics manufacturing, proudly announces the expansion of its production capabilities with the integration of Test Research, Inc.'s (TRI) cutting-edge X-ray inspection system, the TR7600F3D SII.
Global Automated Optical Inspection Systems Industry Revolutionize Electronics Manufacturing with Advanced Quality Control
01/13/2025 | Globe NewswireThe global automated optical inspection (AOI) system market is poised for substantial growth, with sales estimated at USD 849.5 million in 2024 and projected to reach USD 2,067.0 million by 2034.
TRI Launches 3D AXI Platform with Clearer Imaging
01/10/2025 | TRITest Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600FB SII system, designed to deliver clearer imaging.
TRI to Host Test and Inspection Technology Seminars
01/02/2025 | TRITest Research, Inc. (TRI) is proud to announce the 2025 Technology Seminars, which will feature Innovative Inspection Solutions, SPI, AOI, AXI, and ICT solutions at a series of technology seminars and product demos held in Taiwan, Shenzhen, and Suzhou.
TRI to Exhibit Advanced Test and Inspection at IPC APEX Expo 2025
01/01/2025 | TRITest Research, Inc. (TRI) will join the IPC APEX EXPO 2025 held at Anaheim Convention Center on March 18 – 20, 2025. Visit TRI at booth #2905 to experience TRI's latest test and inspection solutions for the electronics manufacturing Industry.