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EMA Design Automation and Hawk Ridge Systems Reshape Landscape with Full ECAD/MCAD Convergence
February 7, 2024 | EMA Design AutomationEstimated reading time: 1 minute
EMA Design Automation and Hawk Ridge Systems entered a strategic partnership to give customers a full ECAD/MCAD design experience, leveraging best-in-class tools and support for the entire electronic product design flow.
EMA Design Automation, Inc. is the world's premier electronic design automation (EDA) value-added reseller (VAR). Hawk Ridge Systems is the leading provider of 3D design, manufacturing and 3D printing solutions in the U.S. and Canada.
As electronic product design continues to grow in complexity and scale, the traditional silos between electrical and mechanical domains are inhibiting teams from meeting their design goals and timelines. End-to-end solutions are needed, along with deep domain expertise, to help customers develop fully connected flows to solve their design challenges.
“As the ECAD and MCAD domains continue to converge, there is a great need to help customers manage the realities and requirements of a fully integrated design environment across the electrical and mechanical product development process,” said Manny Marcano, President and CEO of EMA Design Automation. “Partnering with Hawk Ridge Systems brings two companies together with unmatched expertise in electrical and mechanical design to help customers confidently deliver successfully electromechanical products on the first pass.”
Through this partnership, Hawk Ridge Systems will now sell and distribute Cadence and EMA ECAD design solutions to their customers. These state-of-the-art solutions were developed with 30+ years of electronics design expertise and support from EMA.
“Our customers are looking for solutions to help them bridge the gap between MCAD and ECAD to operate more efficiently and effectively as they design their products,” said Dale Ford, CEO at Hawk Ridge Systems. “This partnership with EMA allows us to instantly provide expert guidance and support to our customers for the electronics in their electromechanical systems. We're excited to be working with EMA."”
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Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
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Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications
03/12/2025 | PRNewswireTexas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.
Speaking the Same Language as Your Fabricator
03/12/2025 | Andy Shaughnessy, Design007 MagazineWe do indeed have a failure to communicate; designers and fabricators often seem to be talking past each other, which can lead to jobs being put on hold. We asked Jen Kolar, VP of engineering for Monsoon Solutions, and columnist Kelly Dack to share their thoughts on ways that we can break down the communication barrier between design and fabrication. As they point out, a design kickoff checklist and a solid review process can be invaluable tools in a designer’s toolbox.