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Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper

05/09/2025 | Michael Carano -- Column: Trouble in Your Tank
In the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.

A Look Into the Future With Futurist Kevin Surace

04/07/2025 | Barry Matties, I-Connect007
In this interview after his keynote address at IPC APEX EXPO 2025, futurist Kevin Surace reflects on important lessons learned and how they shaped his own future. He also makes some bold predictions for the use of AI in PCB board design, fabrication, and assembly—and what the common household will look like in 10 years. It’s an exciting and adventurous step into a future where humans work alongside robots, all for the betterment of everyone.

AGC Multi Material is Highlighting their Range of Substrate Materials at IPC APEX EXPO 2025

03/04/2025 | AGC Multi Material America
AGC Multi Material America (AMMA) is exhibiting in the IPC Apex exhibition in Anaheim, CA on March 18 - 20, 2025.

Mustaches and Automation in Flexible PCB Fabrication

06/24/2024 | Chris Clark, Flexible Circuit Technologies
In any manufactured product, whether a house or a flexible circuit, there is always a raw material component in the overall cost. In the flexible circuit, flexible heater, and rigid-flex industry, sheet materials can account for 20–60% of the overall price. Admittedly, this is a very broad range, but factors, such as how common the materials are in the region where they are made, can cause this to swing one way or the other. Your actions as an engineer or sourcing agent have an impact on overall cost, which I’ll illustrate through the example of building a house.

The Shaughnessy Report: In Bed With Embedded

02/12/2024 | Andy Shaughnessy -- Column: The Shaughnessy Report
We’re always hearing about PCB technology running into a wall. On the design side, Moore’s Law hit one such wall. On the fab side, features are now so tiny that the traditional subtractive methods have hit another type of wall. And we see OEMs who never planned to use flexible circuits wind up embracing them, because rigid boards just won’t fit into a new product’s form factor. In the February 2024 issue of Design007 Magazine, our expert contributors lay down the foundation of knowledge that designers need to be aware of to make intelligent, educated decisions about embedded design.
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