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Bittele Electronics Expands Markham Facility to Enhance Inventory Accuracy
February 12, 2024 | Bittele ElectronicsEstimated reading time: 1 minute
Bittele Electronics, a leading provider of prototype and small-to-mid volume PCB assembly services, announces the expansion of its Markham assembly facility. The strategic move aims to improve inventory accuracy and streamline operations for valued customers.
The expansion primarily focuses on enhancing the component warehouse, allowing Bittele Electronics to provide more storage space for consigned inventory. As extended part lead times continue to challenge the component market, Bittele Electronics recognizes the importance of efficient inventory management. With the expanded warehouse, the company can now store consigned parts for ongoing and upcoming orders. Additionally, they offer the option of purchasing and stocking critical items from a customer’s Bill of Materials (BOM) upon request.
Ben Peng Yang, CEO of Bittele Electronics, expressed his enthusiasm about the expansion: “We are committed to delivering exceptional service to our clients. By expanding our Markham facility, we strengthen our ability to meet their needs promptly and accurately. The increased storage capacity ensures that our inventory remains well-organized and readily accessible.”
In addition to the expanded warehouse, Bittele Electronics has invested in cutting-edge technology. They have recently installed a new Soltec Wave Soldering Machine, which will be utilized for larger-volume, through-hole assembly. This addition complements their existing Ersa Selective Soldering Machine and will be operational later this summer.
Bittele Electronics remains dedicated to innovation, quality, and customer satisfaction. Their expanded facility reflects their commitment to staying at the forefront of the electronics manufacturing industry.
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Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
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