SIA Applauds Launch of Over $5 Billion in CHIPS R&D Investments, Workforce Initiatives
February 12, 2024 | SIAEstimated reading time: 2 minutes
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the administration’s launch of over $5 billion in semiconductor R&D investments through the National Semiconductor Technology Center (NSTC), as well as funding for vital semiconductor workforce initiatives and other programs. The NSTC is a critically important entity established by the CHIPS and Science Act of 2022 to promote U.S. semiconductor R&D. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
“Today’s announcement ushers in the next phase of implementing the landmark semiconductor R&D and workforce initiatives in the CHIPS and Science Act and fulfilling its tremendous promise to reinforce America’s economy, national security, and technological leadership. We applaud leaders in Washington for advancing funding for the NSTC and other vital semiconductor programs. I was honored to attend today’s announcement at the White House, and we look forward to continuing to work with the administration to ensure effective and expeditious implementation of these initiatives, which will strengthen U.S. semiconductor innovation, production, and the domestic chip workforce for many years to come.”
Semiconductor R&D fuels America’s economic growth, national security, and technological competitiveness. The NSTC was established to invigorate semiconductor innovation in the U.S. and drive workforce development opportunities to meet the needs of our rapidly growing industry.
SIA and the Boston Consulting Group (BCG) in October 2022 released a report identifying five key areas of the semiconductor R&D ecosystem that should be strengthened by the CHIPS Act’s R&D funding. The report, titled “American Semiconductor Research: Leadership Through Innovation,” highlights the importance of government-industry collaboration on the NSTC and the National Advanced Packaging Manufacturing Program (NAPMP). The study also calls for CHIPS funding to be used to bridge key gaps in the current semiconductor R&D ecosystem to help pave the way for sustained U.S. chip innovation leadership.
The CHIPS Act’s manufacturing incentives have already sparked substantial investments in the U.S. In fact, companies in the semiconductor ecosystem have announced dozens of new projects across America—totaling more than $220 billion in private investments—since the CHIPS Act was introduced. These announced projects will create more than 40,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout this economy.
Suggested Items
Forge Nano Secures $40M to Scale U.S. Battery Manufacturing and Commercial Semiconductor Equipment Businesses
05/02/2025 | Forge NanoForge Nano, Inc., a technology company pioneering domestic battery and semiconductor innovations, announced the successful close of $40 million in new funding.
Commerce Secretary Howard Lutnick Visits TSMC Arizona Fabrication Facility for Third Fab Ground Breaking
05/02/2025 | U.S. Department of CommerceU.S. Secretary of Commerce Howard Lutnick visited the Taiwan Semiconductor Manufacturing Company (TSMC) semiconductor fabrication facility in Phoenix, Arizona where the company broke ground on a third fab facility.
SIA Welcomes Legislation to Strengthen U.S. Semiconductor Manufacturing Credit
05/02/2025 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer welcoming House introduction of Building Advanced Semiconductors Investment Credit (BASIC) Act.
INEMI Smart Manufacturing Tech Topic Series: Enhancing Yield and Quality with Explainable AI
05/02/2025 | iNEMIIn semiconductor manufacturing, the ability to analyze vast amounts of high-dimensional data is critical for ensuring product quality and optimizing wafer yield.
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
05/01/2025 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.