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In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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Advancing Innovation: IPC CEMAC Fosters Cooperation
February 15, 2024 | Glenn Gong, IPC AsiaEstimated reading time: Less than a minute
In October, IPC China hosted IPC CEMAC, the annual landmark event focusing on the most critical topics in the electronics manufacturing industry.
“It serves as a prominent platform to facilitate communication and promote cooperative opportunities within the electronics industry,” says Sydney Xiao, president, IPC Asia Pacific. “We earnestly invite more people to participate because it inspires industry innovation and fosters collaboration.”
More than 300 representatives from 200 prominent companies gathered in Shanghai for the event with the theme, “Building an Intelligent Future: Innovation and Cooperation in the Electronics Industry.” The event had IPC standards at its core and was dedicated to creating a high-value platform for mutual exchange and learning among professionals in the electronics industry.
IPC President and CEO John W. Mitchell, and Hongliang He, vice secretary-general of the China Electronics Industry Standardization Technology Association, delivered keynotes. The event also featured six forums, covering the topics of automotive electronics, talent training and development, innovative products and solutions, advanced packaging, Factory of the Future, and ESG sustainability.
To read the rest of this article, which appeared in the Winter 2024 issue of IPC Community, click here.
Suggested Items
Making Waves With Solder Paste Jetting
09/11/2024 | Josh Casper, Horizon SalesAs electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing.
Register Now for NEDME 2024
09/11/2024 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) is back for another year of innovation, collaboration, and industry-leading insights. On Wednesday, October 30, 2024, join professionals from the electronics design and manufacturing sector at the Wingspan Event & Conference Center for a full day of cutting-edge exhibits, expert speakers, and unparalleled networking opportunities.
Wearable Technology Market to Grow by $87.3 Billion from 2024-2028
09/10/2024 | PRNewswireReport on how AI is redefining market landscape- The global wearable technology market size is estimated to grow by USD 87.3 billion from 2024-2028, according to Technavio.
Tata Electronics, ASMPT Partner for India Semiconductor Growth
09/10/2024 | PRNewswireIn a significant step towards accelerating its readiness for its semiconductor assembly and test facilities in Vemagal, Karnataka and Jagiroad, Assam, Tata Electronics signs a Memorandum of Understanding (MOU) with ASMPT Singapore to collaborate on establishing semiconductor assembly equipment infrastructure and solutions.
A Parametric Approach to the Environmental Impact of PCB Fabrication
09/09/2024 | Maarten Cauwe, imecSustainability for electronics is receiving more attention due to environmental concerns, regulatory obligations, and to ensure competitiveness in a growing market for sustainable products. To facilitate the discussion on the environmental impact of electronics, there is a strong need for data on energy use, carbon footprint, greenhouse gas (GHG) emissions, hazardous chemicals used during manufacturing, waste generation, etc.