Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Advancing Innovation: IPC CEMAC Fosters Cooperation
February 15, 2024 | Glenn Gong, IPC AsiaEstimated reading time: Less than a minute
In October, IPC China hosted IPC CEMAC, the annual landmark event focusing on the most critical topics in the electronics manufacturing industry.
“It serves as a prominent platform to facilitate communication and promote cooperative opportunities within the electronics industry,” says Sydney Xiao, president, IPC Asia Pacific. “We earnestly invite more people to participate because it inspires industry innovation and fosters collaboration.”
More than 300 representatives from 200 prominent companies gathered in Shanghai for the event with the theme, “Building an Intelligent Future: Innovation and Cooperation in the Electronics Industry.” The event had IPC standards at its core and was dedicated to creating a high-value platform for mutual exchange and learning among professionals in the electronics industry.
IPC President and CEO John W. Mitchell, and Hongliang He, vice secretary-general of the China Electronics Industry Standardization Technology Association, delivered keynotes. The event also featured six forums, covering the topics of automotive electronics, talent training and development, innovative products and solutions, advanced packaging, Factory of the Future, and ESG sustainability.
To read the rest of this article, which appeared in the Winter 2024 issue of IPC Community, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.