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Aismalibar to Attend APEC 2024
February 15, 2024 | AismalibarEstimated reading time: 2 minutes
Aismalibar will be attending the APEC, the leading conference for practicing power electronics professionals, in Long Beach, California from February 25th to 29th, 2024 in Booth 552. Aismalibar will be presenting new cooling technologies for power electronics, specifically Thermal Interface Materials (TIMs) and Insulated Metal Substrates (IMS).
Aismalibar Thermal Interface Materials have been designed to improve the combination of fast thermal transmission plus electric isolation, where needed. TIM performance is an important factor designing an effective cooling chain in future high power electronic modules and High Voltage battery systems for mobile and stationary use. Key performance indicators for TIMs are safety and reliability, lifetime performance plus cost effectiveness for high volume productions from a total cost of solution point of view.
Next to best Thermal Conductivity, our Thermal Interface Materials are divided into whether they need electric isolation or the focus is on achieving lowest Thermal Resistance Rth. The dielectric requirements are determined by the power electronic device, its operating voltage and the applicable regulations regarding ground insulation. Aismalibar has developed a variety of TIM surfaces to reduce air cavities, that can occur between TIMs and the heatsinks or electronic components. Also self-adhesive TIMs are available, which can help optimising production process in users’ high volume production.
COPPERFILLER and BOND SHEET CURED offer high-performance alternative solutions to current thermal pads or thermal paste. Aismalibar’s new “AirGapFiller (AGF) technology”, silicone free in e.g. 50um makes the production process easy to apply small TIM thicknesses and avoids thermal paste negative long term effects, “pump-out” / “dry-out”.
The new COBRITHERM ALP is made out of an aluminum base that is dielectrically insulated by a glassless layer to achieve isolation level of e.g. >4KV at 100um thickness. It is designed to build structures, covers, partitions or radiators, among other solutions. It is completely high voltage insulated and guarantees excellent contact between power electronic components / battery and its dissipation elements.
IMS METAL CLAD Is a thick aluminum or copper based substrate, cladded in ED copper foil, designed for an effective thermal dissipation and high electrical insulation. Our proprietary formulated polymer-ceramic ensures high thermal conductivity, dielectric strength, and thermal endurance. AISMALIBAR’s Insulated Metal Substrates allow processing by standard PCBs procedures, integrating heat dissipation with no need for extra components and SMD assembly process. For the growing complexity of PCB circuitry, Aismalibar offers solutions for double side IMS PCBs.
Visit us at booth 552 to learn more about our products.
We look forward to speaking with you.
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