Marcy’s Musings: Advancing the Advanced Materials Discussion
The Marketing Minute: Cracking the Code of Technical Marketing
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
Aismalibar to Attend APEC 2024
February 15, 2024 | AismalibarEstimated reading time: 2 minutes
Aismalibar will be attending the APEC, the leading conference for practicing power electronics professionals, in Long Beach, California from February 25th to 29th, 2024 in Booth 552. Aismalibar will be presenting new cooling technologies for power electronics, specifically Thermal Interface Materials (TIMs) and Insulated Metal Substrates (IMS).
Aismalibar Thermal Interface Materials have been designed to improve the combination of fast thermal transmission plus electric isolation, where needed. TIM performance is an important factor designing an effective cooling chain in future high power electronic modules and High Voltage battery systems for mobile and stationary use. Key performance indicators for TIMs are safety and reliability, lifetime performance plus cost effectiveness for high volume productions from a total cost of solution point of view.
Next to best Thermal Conductivity, our Thermal Interface Materials are divided into whether they need electric isolation or the focus is on achieving lowest Thermal Resistance Rth. The dielectric requirements are determined by the power electronic device, its operating voltage and the applicable regulations regarding ground insulation. Aismalibar has developed a variety of TIM surfaces to reduce air cavities, that can occur between TIMs and the heatsinks or electronic components. Also self-adhesive TIMs are available, which can help optimising production process in users’ high volume production.
COPPERFILLER and BOND SHEET CURED offer high-performance alternative solutions to current thermal pads or thermal paste. Aismalibar’s new “AirGapFiller (AGF) technology”, silicone free in e.g. 50um makes the production process easy to apply small TIM thicknesses and avoids thermal paste negative long term effects, “pump-out” / “dry-out”.
The new COBRITHERM ALP is made out of an aluminum base that is dielectrically insulated by a glassless layer to achieve isolation level of e.g. >4KV at 100um thickness. It is designed to build structures, covers, partitions or radiators, among other solutions. It is completely high voltage insulated and guarantees excellent contact between power electronic components / battery and its dissipation elements.
IMS METAL CLAD Is a thick aluminum or copper based substrate, cladded in ED copper foil, designed for an effective thermal dissipation and high electrical insulation. Our proprietary formulated polymer-ceramic ensures high thermal conductivity, dielectric strength, and thermal endurance. AISMALIBAR’s Insulated Metal Substrates allow processing by standard PCBs procedures, integrating heat dissipation with no need for extra components and SMD assembly process. For the growing complexity of PCB circuitry, Aismalibar offers solutions for double side IMS PCBs.
Visit us at booth 552 to learn more about our products.
We look forward to speaking with you.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
The Road to Reliability: Why EV Electronics Matter More Than Ever
09/16/2025 | Stanton Rak, SF Rak CompanyThe global transition to e-Mobility is redefining the design and reliability expectations of automotive electronics. Unlike their internal combustion engine (ICE) counterparts, EVs operate under "always-on" conditions and are subject to higher voltages, higher currents, and elevated thermal loads. These systems also incorporate exponentially more sensors, control units, and advanced power electronics, often tightly packed in thermally constrained spaces.
Akrometrix Announces Next Generation Thermal Warpage Measurement Tool the PS600T
09/05/2025 | Akrometrix LLCAkrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for semiconductor and electronics industries, recently announced the next generation in thermal warpage metrology with its PS600T system.
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.
Indium to Highlight Energy-Efficient, High-Reliability Solder Solutions for EV and Electronics at Productronica India
09/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at Productronica India, to be held September 17-19 in Bengaluru, India.