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iNEMI Packaging Tech Topic Series: Damage-Free Rapid Electron Beam Testing for Advanced Packaging

07/24/2024 | iNEMI
Testing issues are limiting chip makers’ ability to create larger SOCs (system-on-chip). The scan field dimensions of EUV (extreme ultraviolet light) and NA (numerical aperture) EUV, which are typically used for testing, are too small.

TRI Brings High-Speed Line Inspection at the SMTA Guadalajara 2024

07/24/2024 | TRI
Test Research, Inc. (TRI) will join the SMTA Guadalajara Expo 2024 to showcase our award-winning Inspection solutions for the SMT industry. Visit booth #1018 at the SMTA Expo Guadalajara from September 11 to 12, 2024, to experience the latest test and inspection innovations for the Electronics Manufacturing Industry.

BOOK EXCERPT: The Printed Circuit Assembler’s Guide to... Encapsulating Sustainability for Electronics, Chapter 3

07/24/2024 | I-Connect007 Editorial Team
This chapter provides an in-depth analysis of general-purpose and specialist encapsulation resins for electronic applications. Also covered are properties, testing methods, suitability for harsh environments, and thermal management of high-power density electronic devices.

Keysight, University of Malaga’s MobileNet Join Forces to Accelerate Open RAN Development with RAN Intelligent Controller Testing

07/23/2024 | BUSINESS WIRE
Keysight Technologies, Inc. announces that the University of Malaga, specifically the MobileNet: Mobile & Aerospace Networks Lab within the Telecommunications Institute (TELMA), has selected its RAN Intelligent Controller Test Solutions (RICtest).

Koh Young to Host SMTA Atlanta Chapter Technical Meeting on State-of-the-Art Test Techniques Presented by Vaughan Carlson from VALUE Engrafting

07/23/2024 | Koh Young
Koh Young, the industry leader in True3D™ measurement-based inspection solutions and proud SMTA corporate sponsor, is excited to announce that it will host the next Atlanta Chapter technical meeting at its Americas Headquarters in Duluth, Georgia.
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