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On the Line With... Podcast Talks With Cadence Expert on Manufacturing

04/18/2024 | I-Connect007
In “PCB 3.0: A New Design Methodology: Manufacturing” Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so, too, do the rulesets designers must abide by.

New Book on Low-temperature Soldering Now Available

04/17/2024 | I-Connect007
I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.

Now Available: Episode 4, Season 2 of Designing for Reality—Lamination

04/04/2024 | I-Connect007
I-Connect007 has just released the latest episode of its podcast series, On the Line With..., which focuses on designing for reality in the electronics industry. Multilayer boards bring along a completely different set of processes. In this installment, ASC Sunstone VP/Manager Matt Stevenson discusses manufacturing techniques for multilayer boards. Of course, this necessitates a review of drill and registration techniques, followed by the ins and outs of lamination.

I-Connect007 Adds to Technical Library With Book on Factory Analytics by Cogiscan

04/03/2024 | I-Connect007
I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Factory Analytics: Unlocking Efficiency Through Data Insights. Thirty-eighth in a series of educational technical books published by I-Connect007, this book is a guide to understanding how analyzing your factory data is the key to competitive advantage for your factory.

MacDermid Alpha Electronics Solutions’ New Book Now Available for Download

03/29/2024 | I-Connect007
I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics by Beth Turner at MAES. The latest in a series of educational books published by I-Connect007, this book is an introductory guide to understanding encapsulation resins and a tool for application troubleshooting. 
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