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Suggested Items

Connect the Dots: The Future of Designing for Reality—Electroless Copper

11/25/2025 | Matt Stevenson -- Column: Connect the Dots
On a recent episode of I-Connect007’s On the Line With… podcast, we discussed electroless copper deposition—depositing a thin copper layer into the through-holes and vias of what will eventually become a printed circuit board. Specifically, it is a chemically catalyzed deposition of copper, mainly to the epoxy inside the holes (as well as on the entire surface of the board). Electroless differs from electrolytic in that electrolytic deposition relies on electricity. 

The Impact of the AI Boom on PCB and Raw Materials Supply Chains

11/13/2025 | Mark Goodwin, Ventec International Group
The PCB industry is entering a period of unprecedented structural change, driven by the demands of artificial intelligence and advanced computing. What was once a cyclical market has become a capacity race. It’s one that rewards foresight, collaboration, and strategic supply partnerships. Understanding these dynamics is essential for maintaining stability and growth across all market segments. This report, created by Ventec International Group, provides a clear view of how AI-driven demand is reshaping the PCB materials landscape and what actions are required to secure long-term supply.

UHDI Fundamentals: An Overview of UHDI Substrate Materials and Vias

11/13/2025 | Anaya Vardya, American Standard Circuits
The rapid proliferation of 5G/6G communications, Internet of Things (IoT), high-performance computing (HPC), AI, and medical electronics has driven the need for increasingly compact, high-performance circuit packaging. UHDI, defined by feature sizes well below traditional HDI, addresses these demands by enabling ultra-fine lines, dense via interconnects, and embedded passive functionality. Understanding the materials and layering strategies in UHDI is essential for advancing both manufacturing and application design

MacDermid Alpha Electronics Solutions to Feature an Integrated Materials Platform Engineered for Long-Term Reliability at Productronica

11/12/2025 | MacDermid Alpha Electronics Solutions
Every advancement in electronics raises expectations for enhanced performance and environmental stewardship. Meeting these challenges demands materials engineered for reliability and developed to support sustainable manufacturing. Industry momentum across connected devices, high-reliability automotive electronics, and rapidly increasing compute density is elevating the role of materials selection as a core driver of long-term system performance. 

Real Time with... SMTAI 2025: Enhancing Device Reliability With Innovative Materials from MacDermid Alpha Electronics Solutions

11/10/2025 | Real Time with...SMTAI
Marcy LaRont speaks with Anna Lifton, MacDermid Alpha Electronics Solutions, who discusses the significance of reliability in devices through advanced materials. Anna highlights MacDermid Alpha's foray into polymer chemistry, showcasing new UV curing materials that address electrochemical reliability and thermal cycling challenges. The conversation also covers the difficulties hardware manufacturers encounter, particularly in thermal management and environmental compatibility.
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