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NEC UPF Achieves Industry-Leading High Performance in 5G Core Networks, reaching 1.3Tbps Throughput
February 23, 2024 | JCN NewswireEstimated reading time: 1 minute
NEC Corporation (NEC; TSE: 6701) has confirmed that its User Plane Function (UPF) for processing user data traffic in 5G core networks (5GC) has achieved an industry-leading throughput of 1.3Tbps per server on Intel servers with 4th generation Intel Xeon Scalable processors.
As 5G advances towards the Beyond 5G/6G era, and next-generation information and communications infrastructure are introduced, communications traffic is expected to increase dramatically due to the spread of high-definition video distribution, AR, VR, and AI. Under these circumstances, telecom operators are being compelled to continuously expand their facilities, resulting in increased power consumption and costs that are becoming a major business challenge.
NEC has been working in recent years to improve UPF performance and its processing efficiency by applying advanced approaches such as optimizing CPU processing, accelerating memory access, and reducing memory access delays. NEC has also been continuously evaluating the latest hardware to improve performance and has now successfully confirmed the groundbreaking high throughput of 1.3Tbps in the testing of a UPF on servers using 4th generation Intel® Xeon® scalable processors. Moreover, NEC has ensured the energy efficiency of the UPF by using Intel® Infrastructure Power Manager, enabling the company to offset the influence of increasing power consumption in pursuit of carbon neutrality.
This achievement helps to significantly improve the performance of mobile network traffic processing, as well as contributing to lower power consumption and costs.
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09/15/2025 | PR NewswireThe global demand for AI-driven, touchless wearable technologies is accelerating as consumers seek more natural, seamless and intuitive ways to interact with their devices. Traditional touch screens and voice assistants, while effective, are increasingly viewed as limiting in a world where multitasking, mobility and efficiency are key. As industries from consumer electronics to augmented reality and enterprise computing embrace the possibilities of gesture-based control, the market for neural interfaces is rapidly expanding
Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
09/09/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO).
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.