Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
SMT007 Magazine March 2024: Take a Look at Our IPC APEX EXPO Pre-show Issue
March 4, 2024 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
This month’s issue of SMT007 Magazine devotes its pages to a comprehensive preview of the cannot-be-missed IPC APEX EXPO event in Anaheim, California, April 6-11, 2024.
The week-plus long event hosts several overlapping programs. There's the standards committee work at the heart of the IPC mission; then there’s the technical program boasting papers and presentations on some of the most influential research in our industry. And, of course, there’s the exposition portion—an enormous three-day trade show. Then there are the professional development programs, the special sessions on emerging technical topics, plus keynotes from industry leaders, awards banquets, and networking opportunities galore – both formal and informal.
If that weren’t enough, ECWC16, the Electronic Circuits World Convention (a once-every-three years PCB symposium) will be hosted by IPC at APEX EXPO 2024 this year. Held in different cities worldwide, ECWC provides a valuable platform to encourage knowledge sharing about the latest information on global PCB demand, PCB manufacturing processes, and promotes the domestic PCB industry in every country and every region.
For industry professionals looking to keep up with the latest, or push your knowledge forward, IPC APEX EXPO 2024 really delivers!
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.