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TopLine, TANAKA to Co-exhibit at IPC APEX 2024
March 6, 2024 | TopLineEstimated reading time: Less than a minute
TopLine Corporation will co-exhibit in booth #1231 with Tanaka Precious Metals at the upcoming IPC APEX 2024 conference and exhibition at the Anaheim Convention Center, Anaheim, California, April 9 – 11. At IPC Apex, At IPC Apex, TopLine will display CCGA, BGA, daisy chain test components as well as bonding wire by Tanaka Precious Metals.
IPC APEX EXPO 2024 is the electronics manufacturing industry’s largest event in North America, featuring a world-class trade show, cutting-edge technical conference, professional development courses taught by industry experts, non-stop networking and more, in Anaheim, California, April 6-11, 2024, where IPC APEX EXPO hosts the Electronic Circuits World Convention 16 (ECWC16).
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Eighteen New Semiconductor Fabs to Start Construction in 2025
01/08/2025 | SEMIThe semiconductor industry is expected to start 18 new fab construction projects in 2025*, according to SEMI’s latest quarterly World Fab Forecast report. T
Global Semiconductor Sales Increase 20.7% Year-to-Year in November
01/08/2025 | SIAThe Semiconductor Industry Association (SIA) announced global semiconductor sales hit $57.8 billion during the month of November 2024, an increase of 20.7% compared to the November 2023 total of $47.9 billion and 1.6% more than the October 2024 total of $56.9 billion. Monthly sales are compiled by the World Semiconductor.
Marcy LaRont Named I-Connect007 Executive Director
01/08/2025 | IPCMarcy LaRont, a printed circuit board (PCB) industry veteran who has been working as the managing editor for PCB007 Magazine this past year, has been named executive director of the I-Connect007 group of publications, which was purchased by IPC in 2022.
EMS Providers Should ‘Plan Prudently’ in 2025
01/08/2025 | Nolan Johnson, SMT007 MagazineDennis Reed is a senior research analyst who specializes in electronics manufacturing at Edgewater Research, a leading research and market intelligence firm covering a mix of compute—CPU, GPU, memory, both flash and DRAM, and hard drive—and insights on components which includes broad line semiconductor, IP&E distribution, and channels.
SMTA Announces Wafer-Level Packaging Symposium Program
01/08/2025 | SMTAThe SMTA is excited to announce the technical program for the 2025 Wafer-Level Packaging Symposium. The symposium will be held February 18-20, 2025 at The Hyatt Regency San Francisco Airport in San Francisco, California.