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UHDI Fundamentals: Talking UHDI with John Johnson, Part 3
March 7, 2024 | Steve Williams, The Right Approach Consulting LLCEstimated reading time: 1 minute
Editor’s note: This is the final installment in a three-part series. View Part 1 and Part 2.
American Standard Circuits is an early adopter of Averatek’s A-SAP process for its ultra high density interconnect (UHDI) products. In this final part of my interview with industry veteran John Johnson, vice president of business development at American Standard Circuits, we use photos, slides, and materials to discuss what he learned from his previous role at Averatek.
Steve Williams: John, let’s talk about the design benefits of UHDI technology.
John Johnson: It’s really amazing what you can do with UDHI technology. There are some things you have to watch out for in a design and because you can do the ultra-fine lines and spaces, a designer has a lot of things in their toolkit. You have via-in-pad plated over microvias, stacked and staggered microvias, and other different structures. But when designing with A-SAP, you first need to focus on using that ultra-fine line and then going to the other design aspects. Maybe use staggered microvias or several levels of staggered microvias and then use a stacked microvia if you really have to. That removes some reliability traps we've had to deal with because we couldn't reach those ultra-fine lines.
To read this entire conversation, which appeared in the February 2024 issue of Design007 Magazine, click here.
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