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UHDI Fundamentals: Talking UHDI with John Johnson, Part 3
March 7, 2024 | Steve Williams, The Right Approach Consulting LLCEstimated reading time: 1 minute

Editor’s note: This is the final installment in a three-part series. View Part 1 and Part 2.
American Standard Circuits is an early adopter of Averatek’s A-SAP process for its ultra high density interconnect (UHDI) products. In this final part of my interview with industry veteran John Johnson, vice president of business development at American Standard Circuits, we use photos, slides, and materials to discuss what he learned from his previous role at Averatek.
Steve Williams: John, let’s talk about the design benefits of UHDI technology.
John Johnson: It’s really amazing what you can do with UDHI technology. There are some things you have to watch out for in a design and because you can do the ultra-fine lines and spaces, a designer has a lot of things in their toolkit. You have via-in-pad plated over microvias, stacked and staggered microvias, and other different structures. But when designing with A-SAP, you first need to focus on using that ultra-fine line and then going to the other design aspects. Maybe use staggered microvias or several levels of staggered microvias and then use a stacked microvia if you really have to. That removes some reliability traps we've had to deal with because we couldn't reach those ultra-fine lines.
To read this entire conversation, which appeared in the February 2024 issue of Design007 Magazine, click here.
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Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
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Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
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Partial HDI: A Delicate Balance
10/30/2024 | I-Connect007 Editorial TeamPartial HDI can be the perfect solution for designers faced with escape routing from tight-pitch BGAs. But there are a variety of material, signal integrity, and DFM trade-offs to understand before you get fully into partial HDI. We asked Stephen Chavez to explain the fundamentals, as well as the details, of this promising process. Are you using partial HDI?
Financial Risks of Ignoring Copper Grain
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