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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Partial HDI: A Delicate Balance
October 30, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Partial HDI can be the perfect solution for designers faced with escape routing from tight-pitch BGAs. But there are a variety of material, signal integrity, and DFM trade-offs to understand before you get fully into partial HDI.
We asked Stephen Chavez to explain the fundamentals, as well as the details, of this promising process. Are you using partial HDI?
Andy Shaughnessy: What does a partial HDI PCB look like?
Stephen Chavez: A partial high density interconnect (HDI) PCB looks similar to a traditional PCB but with HDI features on some layers, but not all layers. It usually involves a combination of standard through-hole vias along with laser-drilled microvias and possibly buried/blind vias in the outer layers. The internal layers may be manufactured using conventional PCB processes, while only specific layers have the finer features associated with HDI construction.
To read this entire conversation, which appeared in the October 2024 issue of Design007 Magazine, click here.
Suggested Items
One Partial HDI Technique: mSAP
11/05/2024 | Andy Shaughnessy, Design007 MagazineChris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.
Partial HDI: A Complete Solution
10/10/2024 | I-Connect007 Editorial TeamWe recently spoke with IPC instructor Kris Moyer about partial HDI, a process that’s recently been growing in popularity. Partial HDI allows designers to escape route out from tight-pitch BGAs on one layer, where a mechanically drilled plated through-hole is not an option, while avoiding the complexity and expense of sequential lamination cycles. As Kris explains, this process doesn’t add much to the cost, and it’s fairly straightforward. But there are some competing signal integrity and fabrication requirements to contend with. We asked Kris to walk us through this process.
The Shaughnessy Report: Are You Partial to Partial HDI?
10/08/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportSometimes, a little technology is all you need. Star Trek’s Borg character only needs a funky eyepiece contraption to access all The Collective’s data, like an outer space Wi-Fi. Like the Borg’s eyepiece, we may only need a little bit of HDI in one corner of the board. We might only need partial HDI.
October Issue of Design007 Magazine: Partial HDI
10/08/2024 | I-Connect007 Editorial TeamOur expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
SAIC Announces Q1 of Fiscal Year 2025 Results
07/05/2024 | SAICScience Applications International Corporation, a premier Fortune 500® technology integrator driving our nation's digital transformation across the defense, space, civilian, and intelligence markets, today announced results for the first quarter ended May 3, 2024.