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Indium Corporation Celebrates 90 Years of Materials Science Innovation
March 13, 2024 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation, a global leader in materials science and electronics assembly solutions, will commemorate its 90th anniversary on March 13. Indium Corporation’s innovative products, especially its advanced soldering solutions, are found in many common consumer electronics and high-reliability technologies such as electric vehicles, mobile devices, life-saving medical devices, and emerging 5G technology to name just a few.
Indium Corporation was founded in Utica, NY, U.S. in 1934 by Dr. William S. Murray who was instrumental in identifying and enabling the first commercially viable applications for indium metal. Today, the company is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets with facilities in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
The company’s products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Currently, over 5 million EVs are on the road with Indium Corporation’s proven solder and thermal management solutions for high reliability. Additionally, products such as award-winning Durafuse® LT and the company’s Reclaim and Recycle initiative are at the forefront of sustainability within the industry.
“This milestone is a testament to the hard work and dedication of our employees, the trust of our customers, and the support of our global partners,” said President and COO Ross Berntson. “It also provides a great opportunity to reflect on our achievements, celebrate our present successes, and envision a richer future enabled by Indium Corporation’s materials science.”
“True to Dr. Murray’s enduring legacy, we continue to be motivated by curiosity to view materials in new ways,” Berntson added. “Fueled by a commitment to research and development, our industry thought leaders and cutting-edge products, Indium Corporation continues to innovate and grow.”
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Brent Fischthal - Koh YoungSuggested Items
Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS
04/15/2026 | Indium CorporationIndium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.
Double Win: Indium Corporation’s CW-807RS and Indium12.9HF Receive EM Asia Innovation Honors
04/07/2026 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, recently received Electronics Manufacturing (EM) Asia Innovation Awards for its halogen-free CW-807RS flux-cored wire and Indium12.9HF solder paste products.
Indium Corporation Announces Strategic Agreement for Domestic Critical Metals Recovery
04/06/2026 | Indium CorporationIndium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and electronics assembly, announced that it has executed a long-term offtake framework agreement with Flash Metals USA Inc., a wholly owned subsidiary of Metallium Limited (MTM), for the supply of critical metals recovered using Metallium’s Flash Joule Heating technology.
Indium Corporation to Highlight High-Reliability Solder Solutions for EV and Mobile at Productronica India
04/01/2026 | Indium CorporationAs a leading materials provider to the electric vehicle (EV) and e-mobility industries—addressing power module- and PCBA-level applications—Indium Corporation® will showcase its advanced Rel-ion® products at Productronica India, April 8-10, in Greater Noida, India.
Driving Yield and Reliability: Indium to Present Advanced Semiconductor Packaging Solutions at CPCA 2026
03/20/2026 | Indium CorporationIndium Corporation® Senior Area Technical Manager Leo Hu will discuss how innovative interconnect materials can drive higher yields and reliability in semiconductor packaging processes at the International Electronic Circuit Exhibition (CPCA), taking place March 24-26 in Shanghai, China.