Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
Altium to Exhibit Latest Innovations at Embedded World 2024
March 15, 2024 | AltiumEstimated reading time: 1 minute
Altium (ASX: ALU), a global leader in electronics design systems, will be at Embedded World 2024 to reveal its latest innovations across its ecosystem, spanning Altium Designer, Altium 365, Octopart, and Altium Electronics Lifecycle Management, the company’s enterprise-grade digitally integrated system for electronics hardware. Embedded World 2024 takes place April 9-11 in Nuremberg, Germany. Altium will be at Booth 4-305.
“Altium is uniquely positioned to reshape the future of electronics development and production. We are extremely excited to share our vision of a transformed industry ― which is fast becoming a reality ― with the world’s leaders in embedded technology at Embedded World 2024.” - Naomi Hamels, VP Enterprise Marketing, Altium
At Embedded World Booth 4-305, Altium will demonstrate the value it provides to constituents across the entire electronics industry, including enterprises, manufacturers, suppliers, purchasers, and individual designers, Altium's long-time user base.
Electronics Lifecycle Management. Altium now empowers enterprises with a system to connect, manage, and coordinate all people, tools, and processes across the entire lifecycle of electronics hardware design and development.
Octopart Components Search Engine. Altium’s data-driven parts search engine, Octopart, allows suppliers to list components and provides users and purchasers with access and intelligence for the worldwide inventory of electronic components, including sources, prices, and current and future availability.
Altium Designer Software. The latest release of the industry's leading electronics design software, combined with the Altium 365 platform, provides the most productive and efficient design experience for teams and individual designers alike to tackle projects of any complexity.
Altium 365 Platform. Altium's agile electronics development platform, Altium 365, enables Altium to deliver value across its entire product portfolio and ecosystem.
At Booth 4-305, Altium will feature daily presentations from industry experts, demonstrations, discussions with their leaders, and giveaways. Altium is encouraging all Embedded World attendees to experience their booth.
Embedded World is this year’s most anticipated gathering of embedded experts and players, where thousands of embedded business, technology, and thought leaders travel from 75 countries to meet and exchange ideas.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.