Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

European Chips Skills Academy Launches ECS Summer School 2025 to Inspire Future Electronics Talent

04/01/2025 | JCN Newswire
The European Chips Skills Academy (ECSA), an EU-funded project coordinated by SEMI Europe, in collaboration with industry partners AENEAS, EPoSS, and INSIDE, has announced the launch of the ECS Summer School 2025.

Real Time with... IPC APEX EXPO 2025: Highlighting Global PCB Trends and Technologies with all4-PCB

04/01/2025 | Real Time with...IPC APEX EXPO
Andy Shaughnessy and all4-PCB's Ralph Jacobo discuss global distribution trends in the PCB industry, focusing on new technologies in plasma etching and final inspection. Ralph highlights the importance of IC substrate buildup technology and partnerships in the market.

Do You Have X-ray Vision? SMT007 Magazine April Issue Is No Joke

04/01/2025 | I-Connect007 Editorial Team
As component packaging continues to evolve, the capability of inspecting through components is crucial. Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question—and others—to bring more efficiency to your bottom line.

IPC APEX EXPO 2025: We’ve Got It Covered

04/01/2025 | I-Connect007 Editorial Team
IPC APEX EXPO is the largest electronics manufacturing trade show in North America, bringing together professionals from all sectors of the supply chain to educate, network, and share their products and services. We’ve put all our coverage of the show in one easy-to-find location. Just click on “Videos,” “Show Coverage” and “Photos” to find what you’re looking for. Check back regularly as more content is added. You won’t want to miss any of our unique coverage. 

Real Time with... IPC APEX EXPO 2025: Akrometrix—Creative Approaches to Measuring Thermal Warpage

03/31/2025 | Real Time with...IPC APEX EXPO
Neil Hubble discusses his research on measuring thermal warpage which focuses on challenges in testing small, thin samples. He introduces non-destructive testing methods that effectively measure without damaging components. Neil highlights the industry's growing interest in AI and outlines future technology goals, including improved resolution and automation to enhance production efficiency.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in