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Manu Skyttä, New President and CEO of Aspocomp Group Plc, Will Assume Duties on May 20, 2024
March 19, 2024 | Globe NewswireEstimated reading time: Less than a minute
Manu Skyttä succeeds Mikko Montonen, who, as previously announced, has agreed with the Board of Directors to step down from the role of President and CEO of the company. Mr. Montonen has committed to staying on as the company's President and CEO until May 20, 2024.
“We are pleased that Manu Skyttä will take up his position as President and CEO of Aspocomp in May. With his character, competence and energy, Mr. Skyttä strengthens Aspocomp’s strategy as a trusted supplier of demanding circuit board technology to all Aspocomp customers. At this point, I would like to thank Mikko Montonen on behalf of the entire Board for his long-term commitment to Aspocomp,” says Päivi Marttila, Chair of Aspocomp’s Board.
Manu Skyttä succeeds Mikko Montonen, who, as previously announced, has agreed with the Board of Directors to step down from the role of President and CEO of the company. Mr. Montonen has committed to staying on as the company's President and CEO until May 20, 2024.
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Julia McCaffrey - NCAB GroupSuggested Items
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The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
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I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.