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Manu Skyttä, New President and CEO of Aspocomp Group Plc, Will Assume Duties on May 20, 2024
March 19, 2024 | Globe NewswireEstimated reading time: Less than a minute

Manu Skyttä succeeds Mikko Montonen, who, as previously announced, has agreed with the Board of Directors to step down from the role of President and CEO of the company. Mr. Montonen has committed to staying on as the company's President and CEO until May 20, 2024.
“We are pleased that Manu Skyttä will take up his position as President and CEO of Aspocomp in May. With his character, competence and energy, Mr. Skyttä strengthens Aspocomp’s strategy as a trusted supplier of demanding circuit board technology to all Aspocomp customers. At this point, I would like to thank Mikko Montonen on behalf of the entire Board for his long-term commitment to Aspocomp,” says Päivi Marttila, Chair of Aspocomp’s Board.
Manu Skyttä succeeds Mikko Montonen, who, as previously announced, has agreed with the Board of Directors to step down from the role of President and CEO of the company. Mr. Montonen has committed to staying on as the company's President and CEO until May 20, 2024.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
SMT007 Magazine July—What’s Your Competitive Sweet Spot?
07/01/2025 | I-Connect007 Editorial TeamAre you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche—what are their insights? In the July 2025 issue of SMT007 Magazine, we spotlight companies thriving by redefining or reinforcing their niche and offer insights to help you evaluate your own.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.