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IPC, FED Partner for New Design Conference in Vienna

12/12/2024 | Andy Shaughnessy, Design007 Magazine
IPC and its German partner FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) is scheduled for Jan. 29-30 at the NH Danube City hotel in Vienna. IPC’s Peter Tranitz, one of the show organizers, discussed how this new show came about, pointing out that, unlike many of the regional conferences in Europe, PEDC will host curated, peer-reviewed presentations, not promotional content or product pitches. Will PEDC become an annual event?

Lockheed Martin Wins MK-48 Mod 7 Guidance and Control System Contract Extension

12/09/2024 | Lockheed Martin
The U.S. Naval Sea Systems Command (NAVSEA) has awarded Lockheed Martin a $245 million dollar contract extension for the MK-48 Guidance and Control (G&C) Mod 7 program.

Infleqtion Secures $11 Million DoD APFIT Award to Accelerate Deployment of Quantum Timing for Defense Applications

12/04/2024 | BUSINESS WIRE
Infleqtion, the world’s leading quantum information company, today announced its receipt of $11 million in funding from the U.S. Department of Defense (DoD) as part of the latest tranche of awards under the Accelerate the Procurement and Fielding of Innovative Technologies (APFIT) program.

TPCA Strengthens Thailand's PCB Industry with Talent Development Initiative

11/29/2024 | TPCA
The Taiwan Printed Circuit Association (TPCA) is taking significant steps to support the growth of Thailand's PCB industry. Acknowledging the rising demand for skilled professionals in the region,

SMTA Announces Program for 2025 Ultra High Density Interconnect (UHDI) Symposium

11/26/2024 | SMTA
The SMTA is excited to announce the technical program for the second annual Ultra High Density Interconnect Symposium which takes place on January 23, 2025 in Peoria, Arizona, USA.
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