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CHIPS Act Funds SK hynix's $3.87 Billion Investment in U.S. Semiconductor Supply Chain

12/19/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded SK hynix up to $458 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

SK hynix Leads the Market with HBM3e 16hi Products, Boosting Capacity Limits

11/14/2024 | TrendForce
SK hynix recently unveiled its development of HBM3e 16hi memory at the SK AI Summit 2024, featuring a 48 GB capacity per cube, with sampling scheduled for the first half of 2025.

DRAM Suppliers Must Carefully Plan Capacity to Maintain Profitability Amid Rising Bit Output in 2025

11/06/2024 | TrendForce
The DRAM industry experienced inventory reductions and price recovery in the first three quarters of 2024; however, pricing momentum is expected to weaken in the fourth quarter.

HBM5 20hi Stack to Adopt Hybrid Bonding Technology, Potentially Transforming Business Models

10/30/2024 | TrendForce
TrendForce reports that the focus on HBM products in the DRAM industry is increasingly turning attention toward advanced packaging technologies like hybrid bonding.

HBM3e 12-Hi Faces Yield Learning Curve and Customer Validation Challenges; 2025 HBM Supply Outlook Remains Uncertain

09/30/2024 | TrendForce
Concerns over a potential HBM oversupply in 2025 have been growing in the market. TrendForce’s Senior Vice President of Research, Avril Wu, reports that it remains uncertain whether manufacturers will be able to ramp up HBM3e production as planned next year.
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