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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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IPC, First and Only Organization in the Electronics Industry to Earn ANSI/ANAB Accreditation for Its Workforce Training
April 2, 2024 | IPCEstimated reading time: 1 minute
IPC, the global leader in electronics education, announces a landmark achievement in professional education and training. Ten of IPC’s critical workforce training programs have been accredited by the ANSI National Accreditation Board (ANAB) under the stringent requirements of ANSI/ASTM E2659-18, Standard Practice for Certificate Programs. This accreditation marks IPC as the first and only organization in the electronics industry to attain this prestigious recognition for its workforce programs.
The accredited training programs include:
- Advanced Design Concepts
- Electronics Assembly for Engineers
- Electronics Assembly for Operators
- Introduction to PCB Design I
- Introduction to PCB Design II
- PCB Design for Manufacturability
- PCB Design for Military & Aerospace Applications
- PCB Design for Rigid-Flex Boards
- PCB Troubleshooting and Defect Analysis
- Wire Harness Assembly for Operators
This accreditation underscores IPC’s commitment to providing high-quality, relevant, and effective training that meets the needs of professionals in the electronics industry. It signifies that IPC’s programs have met rigorous standards for industry alignment, content, instructor qualification, and instructional design, ensuring they deliver valuable knowledge and skills to participants.
“Receiving ANSI/ANAB accreditation is a significant milestone for IPC and a testament to the excellence of our training programs,” said David Hernandez, IPC’s vice president of education. “This recognition not only validates the quality of our education offerings but also reflects our ongoing commitment to setting the highest standards for training in the electronics industry.”
The ANSI/ANAB accreditation is recognized internationally and is a benchmark for certificate programs that adhere to the best practices in instructional design and delivery. It assures employers, professionals, and stakeholders in the electronics industry that IPC’s training courses are among the best available, providing essential skills and knowledge to advance careers and enhance organizational performance.
For more information about IPC’s ANSI/ANAB accredited training programs and how they can benefit professionals and organizations in the electronics industry, visit https://education.ipc.org.
Suggested Items
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
I-Connect007 Releases New Episode of Meet the Author Podcast: Spotlight on Complex PCB Design
12/10/2024 | I-Connect007I-Connect007 is thrilled to announce the latest installment of its Meet the Author podcast series, hosted by Nolan Johnson. In this episode, Johnson interviews Scott Miller and Brian White of Freedom CAD, who share their expertise on complex PCB design.
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial TeamIn this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/06/2024 | Marcy LaRont, I-Connect007This week’s must-reads include a discussion on innovation and embedded components within the layers of a PCB with Accurate Circuit Engineering. We revisit the real cost to manufacture in a case study on how a seemingly small design error can have a dramatic effect on your end customer’s costs. Dan Beaulieu provides this month’s book review highlighting the criticality of fostering creativity in the workplace. Bert Horner of The Test Connection discusses his decision to launch a new, complimentary business venture, The Training Connection; and Ramon Roche of NCAB talks about electric vehicle charging.
If You Can Define It Right, You Can Design It Right
12/05/2024 | Andy Shaughnessy, Design007Design engineer Chris Young is known for his optimized design process. As lead hardware engineer with Moog Space and Defense Group and owner of Young Engineering Services, Chris collects data like it’s going out of style, and he leaves nothing to chance. With that in mind, I asked Chris to discuss his views on rules of thumb—which ones work, which ones should be avoided, and how rules fit ideally into the PCB design process.