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SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs

12/26/2024 | PRNewswire
SP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.

Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project

12/25/2024 | Robosys
Advanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.

IPC Announces New Training Course: PCB Design for Military & Aerospace Applications

12/23/2024 | IPC
IPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.

Effects of Advanced Packaging and Stackup Design

12/26/2024 | I-Connect007 Editorial Team
Kris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”

Beyond Design: AI-driven Inverse Stackup Optimization

12/26/2024 | Barry Olney -- Column: Beyond Design
Artificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.
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