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Collaboration and Innovation: Insights from SMTA's First UHDI Symposium
April 2, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: Less than a minute
Anaya Vardya provides valuable insights on industry collaboration and innovation at the first SMTA UHDI Symposium, delving into the necessity of collaboration in driving innovation and progress within our industry. He shares his experience in helping put this event together, and pride in being a part of bringing the UHDI test board to life.
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LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability
04/24/2025 | LITEON TechnologyLITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.
Real Time with... IPC APEX EXPO 2025: EPOCH Expands With Automation
04/17/2025 | Real Time with...IPC APEX EXPOWith a 35-year history, EPOCH is expanding its operations in Bangalore, India, focusing on automation and customer collaboration. Phil Marcoux leads a task force for AI in PCB design, working with various companies to enhance collaboration, and cites that, historically, data sharing has provided the greatest challenge for AI development. Luckily, he says, that is changing. EPOCH combines AI and traditional methods in manufacturing, especially in product design.
UK, Cyprus Strengthen Space Ties
04/14/2025 | ESAThe first Cyprus-UK Bilateral Cooperation Event brought together representatives from the space sectors and governments of both countries, with the support of the European Space Agency (ESA).
The Key to First-pass Success in PCB Design
04/10/2025 | Gerry Partida, Summit InterconnectIn the dynamic world of PCB manufacturing, achieving first-pass success hinges on more than just cutting-edge equipment and skilled teams. At Summit Interconnect, we have seen countless successful launches of advanced HDI designs that can be traced directly to engagement between designers and fabricators early in the design phase. Unfortunately, collaboration in the PCB industry often begins only after problems arise—such as field failures, assembly fallout, or low fabrication yields. This reactive approach is the wrong starting point for collaboration.
L3Harris, Kuiper Government Solutions Partner on Resilient Satellite Communications Solutions
04/08/2025 | L3Harris TechnologiesL3Harris Technologies and Kuiper Government Solutions LLC (KGS), a subsidiary of Amazon.com, Inc., have partnered to deliver integrated, resilient Satellite Communications (SATCOM) solutions to governments and militaries worldwide.