Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
iNEMI Publishes Four Roadmap Topics
April 4, 2024 | iNEMIEstimated reading time: 2 minutes
The International Electronics Manufacturing Initiative (iNEMI) announces the availability of the first roadmap topics in the new iNEMI Roadmap format. Printed circuit boards, sustainable electronics, smart manufacturing, and mmWave materials and test are now available online.
“The in-depth content on these topics is intended to help companies align technology progress with their respective commercial interests and to support high-volume manufacturing,” says Francis Mullany, iNEMI Director of Roadmapping. “The new format provides a more structured, accessible view of the roadmap that is easily updated based on market movements and technology innovations. And, of course, the roadmap continues to chart the future evolution of electronics manufacturing in terms of application drivers, technical needs, gaps, and technical solutions over a 10-year horizon to help guide R&D investment decisions by industry as well as public research programs and government agencies.”
Initial Topics Include Technologies Critical to Complex Integrated Systems
This initial wave of roadmap topics focuses on key technologies and cross-cutting topics critical to complex integrated systems (CIS), as discussed in a recent iNEMI/IPC whitepaper “Complex Integrated Systems: The Future of Electronics Manufacturing." The scope of each topic area now available is described below.
Printed Circuit Boards — Printed circuit boards (PCBs) are a fundamental element of a vast range of electronic products. The PCB manufacturing ecosystem must continuously evolve and react to “technology blurring” with respect to substrates. The initial iNEMI Roadmap discussion of this topic covers a broad spectrum: high-speed PCBs and substrates; test, inspection and measurement; and environmental issues. Other topics currently under preparation include microwave and mmWave PCBs, laminate-based semiconductor packaging and PCB design.
Sustainable Electronics — Sustainability in the design, manufacture, use and end-of-life handling of electronics systems is an increasingly important consideration across the entire electronics manufacturing ecosystem. The iNEMI Roadmap currently focuses on the full scope of circularity and on key materials used. A new reporting format gathers information on sustainability hot-spot issues and roadmaps mitigating technologies on a per-substance basis.
Smart Manufacturing — The term “smart manufacturing” encompasses the adoption of informed, intelligent, automated manufacturing processes at factory, enterprise, and ecosystem levels for increased flexibility, resiliency and efficiency. The initial release of roadmap content looks at the central topic of data flow architecture and at the increasingly important issue of security of smart manufacturing systems and data.
mmWave Materials and Test — As part of the 5G/6G MAESTRO project, work on this topic was supported by the National Institute of Standards and Technology’s (NIST’s) Office of Advanced Manufacturing. It considers the challenges posed by the operation of electronics at mmWave frequencies and higher. The focus is on the materials and their characterization and electrical test, primarily for PCBs and packaging substrates.
Publication Schedule
In the coming months, the iNEMI Roadmap will:
Provide qualitative market driver assessments and quantitative requirements for multiple application areas
Map technology gaps and potential solution approaches for other critical technology topics such as board assembly, complex integrated systems, modelling and design
Build a dynamic online presence for the iNEMI Roadmap, collaborating closely with other industry roadmaps
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.