-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
iNEMI Publishes Four Roadmap Topics
April 4, 2024 | iNEMIEstimated reading time: 2 minutes
The International Electronics Manufacturing Initiative (iNEMI) announces the availability of the first roadmap topics in the new iNEMI Roadmap format. Printed circuit boards, sustainable electronics, smart manufacturing, and mmWave materials and test are now available online.
“The in-depth content on these topics is intended to help companies align technology progress with their respective commercial interests and to support high-volume manufacturing,” says Francis Mullany, iNEMI Director of Roadmapping. “The new format provides a more structured, accessible view of the roadmap that is easily updated based on market movements and technology innovations. And, of course, the roadmap continues to chart the future evolution of electronics manufacturing in terms of application drivers, technical needs, gaps, and technical solutions over a 10-year horizon to help guide R&D investment decisions by industry as well as public research programs and government agencies.”
Initial Topics Include Technologies Critical to Complex Integrated Systems
This initial wave of roadmap topics focuses on key technologies and cross-cutting topics critical to complex integrated systems (CIS), as discussed in a recent iNEMI/IPC whitepaper “Complex Integrated Systems: The Future of Electronics Manufacturing." The scope of each topic area now available is described below.
Printed Circuit Boards — Printed circuit boards (PCBs) are a fundamental element of a vast range of electronic products. The PCB manufacturing ecosystem must continuously evolve and react to “technology blurring” with respect to substrates. The initial iNEMI Roadmap discussion of this topic covers a broad spectrum: high-speed PCBs and substrates; test, inspection and measurement; and environmental issues. Other topics currently under preparation include microwave and mmWave PCBs, laminate-based semiconductor packaging and PCB design.
Sustainable Electronics — Sustainability in the design, manufacture, use and end-of-life handling of electronics systems is an increasingly important consideration across the entire electronics manufacturing ecosystem. The iNEMI Roadmap currently focuses on the full scope of circularity and on key materials used. A new reporting format gathers information on sustainability hot-spot issues and roadmaps mitigating technologies on a per-substance basis.
Smart Manufacturing — The term “smart manufacturing” encompasses the adoption of informed, intelligent, automated manufacturing processes at factory, enterprise, and ecosystem levels for increased flexibility, resiliency and efficiency. The initial release of roadmap content looks at the central topic of data flow architecture and at the increasingly important issue of security of smart manufacturing systems and data.
mmWave Materials and Test — As part of the 5G/6G MAESTRO project, work on this topic was supported by the National Institute of Standards and Technology’s (NIST’s) Office of Advanced Manufacturing. It considers the challenges posed by the operation of electronics at mmWave frequencies and higher. The focus is on the materials and their characterization and electrical test, primarily for PCBs and packaging substrates.
Publication Schedule
In the coming months, the iNEMI Roadmap will:
Provide qualitative market driver assessments and quantitative requirements for multiple application areas
Map technology gaps and potential solution approaches for other critical technology topics such as board assembly, complex integrated systems, modelling and design
Build a dynamic online presence for the iNEMI Roadmap, collaborating closely with other industry roadmaps
Suggested Items
Zollner Completes Full Acquisition of Bluechips Microhouse
07/01/2025 | Zollner Elektronik AGZollner Elektronik AG has successfully finalized its com- plete takeover of Bluechips Microhouse Co., Ltd., in Thailand. In the future the company will operate as part of the Zollner Group of companies under the leadership of Thomas Kiefl – strategically networked, technologically focused and internationally oriented.
Inission Acquires the Lithuanian Company Selteka
07/01/2025 | InissionInission AB has signed an agreement to acquire 100% of UAB Selteka. Selteka is a well-respected EMS (electronics manufacturing services) company with operations located in Kaunas, Lithuania.
Kitron Strengthens Order Backlog with EUR 11 Million Contract for Defense Communication
07/01/2025 | KitronKitron has received an order valued at EUR 11 million to produce advanced military communication products destined for the European market.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
07/01/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.
IMI Wins Gold Award for Best Managed Technology Company at FinanceAsia’s 29th Asia’s Best Companies Awards
07/01/2025 | IMIIntegrated Micro-Electronics Inc. (IMI) has been awarded the prestigious Gold Award for Best Managed Technology Company at the 29th edition of the Asia’s Best Companies Awards, hosted by FinanceAsia.