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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
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Design007 Magazine April 2024: Level Up Your Design Skills
April 8, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Level Up Your Design Skills
In this issue of Design007 Magazine, our contributors—many of them IPC staff members—discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, designing for flex test, design for reality, chiplet design, and DFM. If you don't come to the conference, you're missing out.
IPC APEX EXPO has been known for years as the largest PCB fabrication and assembly show in the U.S. But in the past decade, the conference portion of IPC APEX EXPO has been increasing its design content, and this year’s event in Anaheim, California offers a cornucopia of PCB design curriculum. And as the IPC Design Competition at APEX moves into its third year, with entrants competing from all over the world in the final heat, this show is shaping up as the place to be for PCB designers and design engineers.
If you don't come to the conference, you're missing out.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Ignite Next Welcomes Synopsys to its Scale-up Program for Deep Tech Innovation
01/20/2026 | PRNewswireIgnite Next, the independent scale-up program for deep tech innovation, announced that Synopsys, the leader in engineering solutions from silicon to systems, has joined the program as a focus technology collaborator.
Announcing the New, Integrated I-Connect007 Magazine
01/20/2026 | I-Connect007 Editorial TeamDesign and fabrication have always been closely connected, but the rising demands for reliability, performance, and cost efficiency now require a closer alignment than ever before. Today we are debuting I-Connect007 Magazine, which brings our Design007 Magazine and PCB007 Magazine under a single title. This evolution enables us to present a more comprehensive view of the PCB and interconnect lifecycle while maintaining the depth, technical rigor, and practical focus that you expect. Look inside!
Symposium Review: A Glimpse Into the Future of IC Substrates and Beyond
01/19/2026 | Edy Yu, Editor-in-Chief, ECIOThe Hong Kong Printed Circuit Association (HKPCA) and the Korea Printed Circuit Association (KPCA), with strong support from SEMI, presented “The Future of IC Substrates and Beyond Symposium 2025” at the Sands Expo and Convention Centre in Singapore in . The event brought together elite professionals, technical experts, and corporate leaders from across the global IC substrate industry chain to explore cutting-edge trends and innovative solutions shaping the future of the sector.
Siemens Acquires ASTER Technologies to Deliver Industry-leading PCB Test Engineering Solutions
01/14/2026 | PRNewswireSiemens announced it has acquired ASTER Technologies ("ASTER"), a privately held market leader in printed circuit board assembly (PCBA) test verification and engineering software.
Avnet Insights Survey: Engineers Embracing AI and Confronting Its Challenges
01/14/2026 | AvnetArtificial intelligence’s (AI) integration in designed products and solutions is here, and engineers are embracing the technology while identifying the challenges it may present.