Fresh PCB Concepts: PCB Plating Process Overview
The Shaughnessy Report: A Stack of Advanced Packaging Info
Connect the Dots: Designing for Reality: Strip-Etch-Strip
Design007 Magazine April 2024: Level Up Your Design Skills
April 8, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Level Up Your Design Skills
In this issue of Design007 Magazine, our contributors—many of them IPC staff members—discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, designing for flex test, design for reality, chiplet design, and DFM. If you don't come to the conference, you're missing out.
IPC APEX EXPO has been known for years as the largest PCB fabrication and assembly show in the U.S. But in the past decade, the conference portion of IPC APEX EXPO has been increasing its design content, and this year’s event in Anaheim, California offers a cornucopia of PCB design curriculum. And as the IPC Design Competition at APEX moves into its third year, with entrants competing from all over the world in the final heat, this show is shaping up as the place to be for PCB designers and design engineers.
If you don't come to the conference, you're missing out.
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Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
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