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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Design007 Magazine April 2024: Level Up Your Design Skills
April 8, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Level Up Your Design Skills
In this issue of Design007 Magazine, our contributors—many of them IPC staff members—discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, designing for flex test, design for reality, chiplet design, and DFM. If you don't come to the conference, you're missing out.
IPC APEX EXPO has been known for years as the largest PCB fabrication and assembly show in the U.S. But in the past decade, the conference portion of IPC APEX EXPO has been increasing its design content, and this year’s event in Anaheim, California offers a cornucopia of PCB design curriculum. And as the IPC Design Competition at APEX moves into its third year, with entrants competing from all over the world in the final heat, this show is shaping up as the place to be for PCB designers and design engineers.
If you don't come to the conference, you're missing out.
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.