-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Microchip Technology Expands Partnership with TSMC to Strengthen Semiconductor Manufacturing Capacity
April 8, 2024 | Microchip Technology Inc.Estimated reading time: 1 minute
Microchip Technology announced it has expanded its partnership with TSMC, the world’s leading semiconductor foundry, to enable a specialized 40 nm manufacturing capacity at Japan Advanced Semiconductor Manufacturing, Inc. (JASM), TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan. This partnership is part of Microchip’s ongoing strategy to build resiliency in its supply chain. Other initiatives include investing in additional technology to boost internal manufacturing capabilities and capacity, as well as establishing more geographical diversity and redundancy with wafer fab, foundry, assembly, test and OSAT partners.
“Microchip’s reputation for providing responsible and reliable supply management is enhanced with this new TSMC manufacturing path,” said Michael Finley, Microchip senior vice president of worldwide manufacturing and technology. “Customers can have confidence when designing our products into their applications and platforms, with the support of resilient and robust manufacturing capabilities.”
The wafer capacity supply from JASM further strengthens Microchip’s ability to serve a broad base of global customers in a variety of markets including automotive, industrial and networking applications.
“This initiative with Microchip is further proof of TSMC’s commitment to supporting our customers’ long-term growth and innovation,” said Rose Castanares, senior vice president of business management at TSMC North America. “Our expanded collaboration with Microchip will ensure that as leading technologies continue to develop, so will our collective ability to manufacture and deliver those capabilities to global customers when they are needed.”
The TSMC partnership and JASM capacity adds more assurance to the manufacturing landscape, helping reduce Microchip’s potential of disrupted supply by offsetting external factors such as frequently changing business conditions and natural disasters.
Suggested Items
TRUMPF Electronics Announces the Opening of a Technical Center in Southeast Asia
05/22/2025 | TRUMPF ElectronicsTRUMPF Electronics, one of world’s leading plasma power suppliers for the semiconductor sector, marked its entry into the Southeast Asian market with a debut at SEMICON SEA 2025, alongside its new regional technical center in Malaysia.
Neways Electronics Celebrates Grand Opening of New Manufacturing Facility in Malaysia
05/22/2025 | Neways Electronics International N.V.Neways, the global innovator in mission-critical technology for semicon, defense & mobility, and connectivity sectors, is proud to announce the grand-opening of a new state-of-the-art manufacturing facility in Selangor, Malaysia.
SEMI, Purdue University Launch AI and Data Analysis Online Courses
05/22/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced it has partnered with Purdue University to launch an online course series focused on artificial intelligence (AI) and data analysis techniques for the semiconductor industry.
STMicroelectronics Announces Expanded "Lab-in-Fab" Collaboration in Singapore to Advance Piezoelectric MEMS Technology
05/22/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, in collaboration with the A*STAR Institute of Microelectronics (A*STAR IME) and ULVAC, announces the expansion of the “Lab-in-Fab” (LiF) in Singapore.
50 Years of productronica: World’s Leading Trade Fair Celebrates Anniversary
05/21/2025 | productronicaWhen productronica takes place in Munich from November 18 to 21, 2025, a milestone birthday will be on the agenda. The world’s leading trade fair for the development and production of electronics is celebrating its 50th anniversary.