-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
IPC Design Competition: On Your Mark, Get Set, Go!
April 10, 2024 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

I recently spoke with IPC’s Patrick Crawford, manager of design standards and related industry programs, and Kris Moyer, certified IPC master instructor, about this year’s IPC Design Competition. Now in its third year, the preliminary heat began in January, and the winners will compete in the final heat at IPC APEX EXPO in Anaheim.
I asked Patrick and Kris to discuss the Design Competition, advice for contestants, and why designers should enter next year’s competition. As Kris points out, an open mind and knowledge of IPC standards will go a long way.
Andy Shaughnessy: Patrick, give us an overview of the IPC Design Competition.
Patrick Crawford: The competition was launched in 2022 from a desire to engage with designers in an extracurricular way, outside of standards, development, and work. This is our third year and it’s been successful so far. We opened registration on Jan. 1, and 50 people signed up in the first week, which is really cool. We do two heats—a preliminary and a final heat. The preliminary heat is an at-home design. We provide contestants with a schematic, a bill of materials, a scope of work—it’s all on paper, and we say, “Go forth and read the design, schematic, specs, and requirements.” We expect them to create a fabrication file for us. The few that we've gotten in so far have all been Gerber and the associated manufacturing files, but in theory, they could also give us IPC-2581.
IPC India has its own competition designed a little differently than ours, but we invite their two finalists. They're essentially assessing the same criteria in a different format. We invite the IPC India winner and runner-up, but we only invite three of the top-placing competitors from the prelims to the final heat. Last year, the final heat featured five competitors: two in the room at IPC APEX EXPO and three people calling in. This year, based on travel budgets and some competitors requiring a visa, I it won’t surprise me to have full virtual attendance. But that doesn't matter; we'll still have competitors. Last year, Sathish Vijayakumar from India, won the IPC India competition and eventually the whole shebang. He couldn't be in India's competition this year, so he signed up for our competition. We'll see if he can take the top prize again.
To read this entire conversation, which appeared in the April 2024 issue of Design007 Magazine, click here.
Suggested Items
IPC Report Recaps Imperatives in Global Chip Race
05/19/2025 | IPCWith funding awards under the U.S. CHIPS and Science Act currently under review, IPC just shared a new Industry Intelligence Report focused on the issues and players involved.
Legislative Update: Is the SEMI Investment Act Inclusive of PCB and Substrates?
05/13/2025 | I-Connect007 Editorial TeamIn response to this week's news about new U.S. legislation being put forth by SEMI to support our domestic electronics supply chain—the Strengthening Essential Manufacturing and Industrial (SEMI) Investment Act—IPC’s Richard Capetto, senior director of North American Government Relations, made the following statement.
Delta Builds First IPC-CFX Demonstration Line in Asia-Pacific
05/14/2025 | Chuck Li, IPC North AsiaAs a key standard in the global electronics manufacturing industry, IPC-CFX has been implemented in various regions worldwide, providing the foundation for digital factory solutions. In the Asia-Pacific region, IPC actively promotes this standard, helping enterprises enhance efficiency and competitiveness through digital transformation.
Hunting for Clues: Feng Xue Solving Circuit Board 'Crimes' With AOI Standard
05/08/2025 | Linda Stepanich, IPCWhen residents in sleepy English villages needed a top-tier detective to solve a murder, they called on Belgian super-sleuth Hercule Poirot, author Agatha Christie’s fictional detective famous for using his “little grey cells” to solve crimes. In the same way, IPC standards development committees, when creating a standard to detect defects in circuit boards using Automated Optical Inspection (AOI), call on IPC A-Team, Hercule.
IPC Strengthens Global Focus with Promotion of Sanjay Huprikar to Chief Global Officer
05/08/2025 | IPCIPC, the global electronics association, announces the promotion of Sanjay Huprikar to chief global officer. This newly created position reflects the association’s forward-looking strategy and industry needs to strengthen the electronics supply chain.