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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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What’s New in Design Education at IPC APEX EXPO?
April 11, 2024 | Kelly Allen, IPC Training ManagerEstimated reading time: Less than a minute
Kelly (Kel) Allen shares her thoughts on the educational offerings at IPC APEX EXPO and beyond. In this interview, she discusses some of the newest classes taking place during the conference in Anaheim, covering everything from design, fab, and assembly through mil/aero, test, and supply chain issues.
Kel, why should PCB designers and design engineers attend the conference at IPC APEX EXPO?
Kelly Allen: Adult learners appreciate practical knowledge. In our online classes, PCB designers and design engineers connect theoretical concepts to real-world situations, making our online classroom discussions dynamic and relevant. Many are driven by personal and professional goals so attending an APEX EXPO Professional Development Course allows them to actively participate, ask the speaker thought-provoking questions, and engage in meaningful dialogue. Our industry keeps our designers so busy that many do not have time to take one of our long-form courses. Yet they can invest a few days to take PD courses, attend committee meetings, network with colleagues, and see the latest in manufacturing and products on the show floor.
To read this entire conversation, which appeared in the April 2024 issue of Design007 Magazine, click here.
Suggested Items
The Companion Guide to 'Designing for Reality' by Matt Stevenson Now Available
12/19/2024 | I-Connect007I-Connect007 is excited to announce the release of "The Companion Guide to...Designing for Reality," written by Matt Stevenson of ASC Sunstone Circuits. This essential resource builds on the foundational insights presented in "The Printed Circuit Designer’s Guide to... Designing for Reality" and delivers advanced strategies for scaling PCB production.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial TeamIn this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.
Rules of Thumb: A Primer
11/14/2024 | Andy Shaughnessy, Design007 MagazineMany industry-wide rules of thumb are based on DFM constraints or formulas, but others are based on tribal knowledge. In this interview, Andy Shaughnessy sits down with our contributors Kris Moyer and Kelly Dack to discuss the role of rules of thumb, when to employ them, and when it’s time to do the math.