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Designers Notebook: Layer Stackup Planning for RF Circuit Boards
IPC WinterCom 2024 Through the Eyes of One Dedicated Student
April 12, 2024 | Sanjay Huprikar, IPCEstimated reading time: 1 minute
Lauriane Testuz stands as a testament to the power of curiosity, perseverance, and the relentless pursuit of knowledge. Her story serves as a reminder that the path to success is often paved by an unwavering commitment to one's dreams.
Lauriane is a second-year student in electrical engineering at ENSEA, a specialized graduate school in France, who was invited to attend IPC WinterCom 2024 in Barcelona this past January. She has a passion for PCB design and assembly and found this event to be a fusion of learning, networking, and personal growth.
She was initially drawn to the world of artificial intelligence (AI), but her trajectory shifted when she discovered an affinity for PCB assembly during a university project. Guided by her school technician and armed with a newfound passion, Lauriane learned about IPC WinterCom. She decided to attend with a clear mission to deepen her understanding of PCB design and secure an internship abroad.
IPC WinterCom was a new event organized by IPC to support standards development committees in face-to-face sessions. During the weeklong series of meetings, the global electronics manufacturing industry met in Europe for the first time to develop and maintain the IPC standards they use to build electronics better.
To read the rest of this article, which appeared in the Spring 2024 issue of IPC Community, click here.
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