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CTEK Shares Tips to Avoid a Dead Battery in Summer Heat

07/26/2024 | PRNewswire
The United States has seen record heat and it doesn't look like it will end anytime soon. As the heat intensifies, it's not just our bodies that need extra care and attention; CTEK says our vehicle batteries also require special consideration to ensure optimal performance and reliability.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2

06/18/2024 | I-Connect007 Editorial Team
Low-temperature solders (LTS) continue to attract serious interest from the electronics industry. These solder alloys enable the use of lower glass transition temperature (Tg) substrates and components due to the lower processing temperature, promote long-term reliability by reducing exposure to thermal excursion, and enable organizations to meet sustainability targets. In this quick-read article are sharing an excerpt from Chapter 1 of the second volume of The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering.

Successful Demonstration of a Superconducting Circuit for Qubit Control within Large-scale Quantum Computer Systems

06/03/2024 | JCN Newswire
In support of the development of large-scale superconducting quantum computers, researchers with the National Institute of Advanced Industrial Science and Technology (AIST), one of the largest public research organizations in Japan, in collaboration with Yokohama National University, Tohoku University, and NEC Corporation, proposed and successfully demonstrated a superconducting circuit that can control many qubits at low temperature.

PCB Market Size to Grow by $29.06B from 2024-2028

05/17/2024 | PRNewswire
The global printed circuit board (PCB) market size is estimated to grow by USD 29.06 bn from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 6.6% during the forecast period.

epoxySet Launches EC-1015HP - High Temperature, Crack Resistant Epoxy Potting

05/13/2024 | epoxySet
epoxySet introduces the EC-1015HP epoxy potting compound.  This heat cure system is designed for temperature cycling from -55 to 180°C with significantly better crack resistance than traditional rigid epoxies.  As a low viscosity encapsulant, it is used for large and small potting applications with fragile components. 
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