-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
A Look Back at 2025
Innovation rippled across the entire electronics supply chain in 2025, from semiconductor packaging and substrate materials to denser boards and more robust designs. This issue explores these defining moments and what we can expect in the year to come.
The Latest in Automation
When customer requirements shift, responses range from new equipment to automation. Explore the newest solutions reshaping production and how today’s market dynamics are driving these trends.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
New Book on Low-temperature Soldering Now Available
April 17, 2024 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download. The latest in a series of educational books published by I-Connect007, this book follows up the first volume, published in 2018 and downloaded by thousands.
Peer Reviewer Kevin Byrd, Intel Corporation, offered his recommendation of the book, stating, “This book provides an excellent overview of both the history of low-temperature solders as well as the recent progress in this exciting surface mount technology. This information will prove valuable for those actively pursuing low-temperature solder conversion of their manufacturing processes as well as those working to understand the progress and future for low-temperature solder materials.”
Download your free copy today at I-Connect007.com/lts2.
We hope you enjoy The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Volume 2.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Beyond IPC-2152: Creating Technology-specific Current-carrying Capacity Design Charts Using Thermal Modeling
01/29/2026 | Mike Jouppi, Thermal Management LLCDesigners commonly size traces using online calculators based on IPC-2221 or IPC-2152 charts, selecting width and thickness for a given current and allowable temperature rise (ΔT). Consideration is given to parallel conductors, although this is not a practical evaluation method for most designs. An important aspect of trace heating, especially groups of traces, is the power dissipated by the conductors. Unfortunately, the power dissipation or a method for accounting for power losses in the traces/conductors or planes is not straightforward.
EpoxySet to Showcase Extensive line of Biocompatible Adhesives at MD&M West
12/09/2025 | epoxySetEpoxySet Inc. will be featuring the expanded line of adhesives, sealing, encapsulating and coating materials certified for biocompatibility at MD&M West on February 3-5, 2026, at the Anaheim Convention Center, Anaheim, CA, Booth 711.
Indium is Electrifying the Future with Advanced Materials Solutions at productronica
11/11/2025 | Indium CorporationAs one of the leading providers in advanced materials solutions for power device packaging and materials for the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at Productronica, taking place November 18-21, in Munich, Germany.
Real Time with... SMTAI 2025: Innovations in Solder Materials— Kevin Brennan's Journey at Indium
11/05/2025 | Real Time with...SMTAIIn this interview from SMTAI 2025, Kevin Brennan shares his five-year journey at Indium Corporation, where he has worked in R&D, process engineering, and product management. Indium focuses on engineered solder materials, introducing new products like halogen-free and high-temperature alloys to meet industry challenges. The discussion covers a shift to low-temperature alloys to reduce warpage in larger chips and highlights the Indium 12.9 HF flux for high-density boards. Kevin reflects on the supportive community at Indium.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.