-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueMechatronics
Our expert contributors discuss the advent of mechatronics in PCB design, the challenges and opportunities this creates for circuit board designers, and the benefits—to the employee and the company—of becoming a mechatronics engineer.
Creating a Culture of Collaboration
PCB designers could learn quite a bit from NASA and the private companies that develop spacecraft: Every one of these vehicles is a testament to the value of collaboration among disparate stakeholders. Without a collaborative culture, the rocket might never get off the ground.
Breaking High-speed Material Constraints
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Designing Electronics for High Thermal Loads
April 16, 2024 | Akber Roy, Rush PCB Inc.Estimated reading time: 2 minutes
![](https://iconnect007.com/application/files/1117/1325/0721/Akber_Roy_300.jpg)
Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.
Thermal Management: A Pinnacle Challenge to Reliability
All electronics generate heat due to energy conduction inefficiencies. This phenomenon arises from inherent electrical resistance in all metals and semiconductors, leading to some energy in the circuit converting to heat. Over time, that heat, if not properly managed, can accumulate and cause damage to sensitive components.
In my capacity, I’ve witnessed an increase in thermal management issues as electronics trend toward higher functionality in smaller packages. Although many thermal management methods and copious amounts of component thermal data are available to assist engineers in understanding thermal loads, thermal issues continue to be difficult to predict, creating unwanted surprises. Unfortunately, these surprises often arise during functional testing, not during the front-end design process. I firmly believe that today’s compact, high-performance electronics must be developed with robust thermal management strategies early in the design cycle. This proactive approach not only reduces development time and costs but also helps product designers ensure that crucial electronic components operate in their optimal temperature range, ultimately enabling long-term product safety and reliably.
To help designers achieve these goals, I’ve developed the following overview of best practices and key considerations for managing heat in electronic systems.
Understand the Factors Affecting Thermal Load
Many factors contribute to the overall thermal load in electronic systems, from power consumption and I/O speeds to component package designs, features, and functions. Drawing on decades of experience supporting PCB fabrication and assembly, it becomes apparent that advanced and simple systems alike can grapple with thermal issues, and there is no one-size-fits-all thermal solution.
I strongly recommend using thermal modeling and simulation tools at the beginning of the design process to aid in understanding the many factors that affect thermal load, identify potential hot spots, and assess the potential effects of different thermal management strategies. This approach makes it possible to accurately predict thermal behavior in complex electronic systems prior to building physical prototypes. With thermal modeling, designers can efficiently optimize their designs, simulating and analyzing multiple design iterations, while experimenting with different components and materials.
To read this entire article, which appeared in the March 2024 issue of Design007 Magazine, click here.
Suggested Items
Thermal Greases for Computers, Electronics and High Tech Devices
07/19/2024 | epoxySetepoxySet produces a wide range of over 40 different thermally conductive greases. These greases are both silicone-based and silicone-free hydrocarbons.
BTU International Appoints E-Tronix as Its Representative in Six States
07/16/2024 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce the appointment of E-Tronix as its representative in North Dakota (ND), South Dakota (SD), Minnesota (MN), Iowa (IA), Wisconsin (WI) and Illinois (IL).
UHDI Fundamentals: UHDI for RF Microwave Applications
07/16/2024 | Anaya Vardya, American Standard CircuitsUltra high-density interconnect (UHDI) technology has significant potential for RF (radio frequency) microwave applications. Its advantages lie in its ability to provide high-density routing and integration, which are crucial for complex RF circuits. Here are three key UHDI benefits in RF microwave applications:
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 2
07/10/2024 | I-Connect007 Editorial TeamThe evolution of low-temperature solder alloys requires thoughtful consideration of the thermal and mechanical reliability requirements specific to each application. Thermal cycling and drop (mechanical) shock tests have long been used as board-level proxy tests for evaluating and quantifying the ability of electronics assemblies to sustain abrupt, short-term mechanical stresses, as well as continuous cyclic stresses.
Indium Corporation Introduces Cutting-Edge, High-Reliability Alloy for Solder Paste
06/14/2024 | Indium CorporationIndium Corporation is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.