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EIPC Summer Conference 2026: Technical Presentations Tell the Rest of the Story

08/12/2026 | Marcy LaRont, I-Connect007
In early June, the EIPC Summer Conference in Vilnius, Lithuania, featured an impressive group of speakers ranging from PCB suppliers and technical experts to startups and robotics OEMs, the latter of which added a “cool factor” to the meeting’s ambiance with a fully operational, interactive humanoid. After some early coverage of the event, I’m now following up with key takeaways from many of the technical presentations. I regret that I could not cover all speakers in detail, but this will give you a good taste of what you missed in Lithuania in June.

Beyond Design: Skip-layer Routing—The Waveguide Structure That Makes 224G Possible

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A Case Study in Conquering High Aspect Ratio Features

07/06/2026 | Richard Nichols, GreenSource Engineering
As demand for high-performance electronics is further driven by advances in AI and machine learning, the importance of high aspect ratio (HAR) through-holes in PCBs and IC substrates has become increasingly apparent. These vias play a vital role in enabling vertical interconnections in complex circuit architectures, especially within HDI structures, where maximizing space and enhancing electrical performance are crucial.

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07/02/2026 | Dymax
Dymax, a global manufacturer of light-curing materials and equipment, celebrated the opening of its new distribution and technical facility in Querétaro, expanding its ability to support customers across Mexico and Latin America.
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