Standard of Excellence: Building the Board of the Future—Materials, Methods, and Mindset
Smart Automation: Preparing for an SMT Line Upgrade—Materials and Setup Verification
Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
On the Line With... Podcast Talks With Cadence Expert on Manufacturing
April 18, 2024 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is excited to announce the release of the latest episode of Series 3 of its popular podcast, On the Line With..., now available on Apple and Spotify.
In “PCB 3.0: A New Design Methodology: Manufacturing” Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so, too, do the rulesets designers must abide by. But rather than seeing them as impossible sets of constraints, Davis shares a vision in which designers can maximize their creative efficiencies while relying on ever more complex design rules to keep everything straight.
I-Connect007 is committed to providing readers, viewers, and listeners with a wide range of digital content and information to help them succeed in the industry. From magazines, books, and newsletters to market reports, podcasts, and event coverage, we provide digital content that suits the needs of our community, with particular emphasis on hearing from the industry itself.
I-Connect007 is the industry's longest-running digital media company and leading publisher of original, exclusive content for the global electronics industry.
Listen now to Episodes 1-3 of PCB 3.0: A New Design Methodology.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
ASC Sunstone Expands Online Quoting to Streamline Flex PCB Procurement
02/17/2026 | ASC Sunstone CircuitsAs demand for compact, lightweight, and high-reliability electronic designs continues to grow, ASC Sunstone is making it easier for engineers to source flex circuitry with Instant Online Quoting for select Flex PCB configurations through its OneQuote® platform at sunstone.com.
I-Connect007 Magazine: APEX EXPO 2026 Preview Plus AI Tools Designers Are Watching
02/17/2026 | I-Connect007 Editorial TeamThis month, I-Connect007 Magazine takes you inside APEX EXPO 2026, highlighting exhibitors and special events on the show floor, insights from the technical conference, updates on apprenticeships and keynotes, and progress in critical standards development. For PCB designers, we go beyond the dreaded auto-router, diving into practical AI-driven design tools that are actually shaping real-world workflows.
Cadence Launches ChipStack AI Super Agent for Next-Gen Chip Design
02/16/2026 | Cadence Design SystemsCadence announced a transformative step forward in redefining how semiconductors are designed with the launch of the ChipStack™ AI Super Agent—an agentic AI solution for front-end silicon design and verification.
American Standard Circuits Manufactures IC Substrate Designs Featuring 5–7 Stacked Microvias
02/13/2026 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading U.S. manufacturer of advanced printed circuit board solutions, has successfully manufactured and shipped multiple IC substrate designs incorporating 5 to 7 stacked microvias using the company’s advanced Ultra High Density Interconnect (UHDI) manufacturing platform.
Astera Labs Opens Israel Design Center to Boost AI Connectivity Expansion
02/13/2026 | Astera Labs, Inc.Astera Labs, Inc., a leader in semiconductor-based connectivity solutions for rack-scale AI infrastructure, announced a significant expansion of its global engineering operations with the establishment of an advanced research and development center in Israel.