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Faster BGA Warpage Processing Without Shearing or Painting

10/21/2026 | Chris Gastaldo and Neil Hubble, Akrometrix
The process of measuring BGA samples for thermal warpage is subject to industry standards from both JEDEC, in JESD22-B112C and JEITA ED7306. Additionally, these standards establish allowable warpage values based on ball size and ball pitch, for the JEDEC standard, pass/fail further established in JEDEC SPP-024.3 Standard practice in these standards for measuring BGA warpage is to remove the solder balls in order to measure only the substrate surface. However, as both ball size and package thickness decrease, the practicality of removing solder balls without altering the sample shape has become increasingly challenging.

OMRON Advances Inspection Technology with NVIDIA Omniverse and Metropolis

07/17/2026 | Omron
OMRON Corporation Industrial Automation Company announced in Japan an expansion of its integration of NVIDIA technologies by combining OMRON's Automated Optical Inspection (AOI) and 3D-CT X-ray Inspection (AXI) with NVIDIA Omniverse libraries.

BEST Inc. Publishes Optimizing BGA Rework Techniques to Ensure Quality Tech Paper

04/15/2026 | BEST Inc.
BEST Inc., a leader in electronic component and PCB services, is pleased to announce they have published a tech paper describing techniques for reworking BGA components to ensure quality during the printed circuit board rework process.

Vinci Ships Production-Grade Thermo-Mechanical Simulation at Manufacturing Scale

02/25/2026 | BUSINESS WIRE
Vinci announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs: how they bend, twist, and deform under real-world thermal conditions.

Real Time with... SMTAI 2025: Innovations in Solder Materials— Kevin Brennan's Journey at Indium

11/05/2025 | Real Time with...SMTAI
In this interview from SMTAI 2025, Kevin Brennan shares his five-year journey at Indium Corporation, where he has worked in R&D, process engineering, and product management. Indium focuses on engineered solder materials, introducing new products like halogen-free and high-temperature alloys to meet industry challenges. The discussion covers a shift to low-temperature alloys to reduce warpage in larger chips and highlights the Indium 12.9 HF flux for high-density boards. Kevin reflects on the supportive community at Indium.
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