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Akrometrix LLC Reports a Record Year of Revenue for 2024

03/04/2025 | Akrometrix LLC
Akrometrix, the global leader in Thermal Warpage Metrology, announces financial results for the full year 2024.

Akrometrix Announces 30 Year Anniversary as Industry Leader in Thermal Warpage Metrology

02/25/2025 | Akrometrix LLC
Akrometrix is celebrating their 30 year anniversary as an industry leader in thermal warpage metrology. Professor Ifeanyi Charles Ume founded Akrometrix out of Georgia Tech 30 years ago to address issues in PCB flatness using the shadow moiré warpage measurement technique. 

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5

12/23/2024 | I-Connect007 Editorial Team
Chapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.

iNEMI HDI Socket Warpage Prediction and Characterization Webinar

11/15/2024 | iNEMI
High-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases.

DELO Introduces UV-approach for Fan-out Wafer-level Packaging

10/25/2024 | DELO
DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.
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