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Suggested Items

SEMI 3D & Systems Summit To Spotlight Trends In Hybrid Bonding, Chiplet Design And Environmental Sustainability

03/26/2024 | SEMI
Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024,

Mycronic's Global Technologies Makes Acquisition in Germany

03/22/2024 | Mycronic
Mycronic’s Global Technologies division has signed an agreement to acquire Vanguard Automation, a company headquartered in Karlsruhe, Germany, which has developed a technology and automated equipment for 3D microfabrication of optical interconnects.

TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSE Preforms

03/12/2024 | JCN Newswire
TANAKA Kikinzoku Kogyo K.K., which develops industrial precious metals products as one of the core companies of TANAKA Precious Metals, announced that it has established a gold particle bonding technology for high-density mounting of semiconductors using AuRoFUSE™ low-temperature fired paste for gold-to-gold bonding.

Design Guidelines for Flexible Printed Circuits

02/15/2024 | Chris Keirstead, PFC Flexible Circuits
An important but sometimes overlooked aspect of flex and rigid-flex fabrication and assembly is the flex circuit tail, which is attached to a rigid PCB with pressure-sensitive conductive adhesives. This sub-assembly is becoming very common. We often see this applied to glass displays and microelectronic applications.

MKS’ Atotech to Participate in Semicon West 2023

07/03/2023 | MKS’ Atotech
MKS’ Atotech will participate at the upcoming SEMICON West – the show connects the extended electronics design and manufacturing supply chain and will take place from July 11 – 13, 2023 at the Moscone Center in San Francisco, USA.
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