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Scalable ZLD and a Solution for PCB Start-ups

05/23/2024 | Alex Stepinski, Stepinski Group
Alex Stepinski talks about his business priorities for this year and what the market, particularly aerospace and defense, needs for orders to be filled. Learn about his goal to develop a central recycling system with a good ROI so that every shop will be able to afford it.

AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Queretaro Expo & Tech Forum

05/23/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Queretaro Expo & Tech Forum taking place on June 6 at Queretaro Centro de Congresos y Teatro Metropolitano in Queretaro, Mexico.

SatixFy, SCOTTY Group Partner to Supply In-Flight Connectivity Terminals

05/23/2024 | BUSINESS WIRE
SatixFy Communications Ltd., a leader in next-generation satellite communication systems based on in-house-developed chipsets, announced a collaboration and the first order of its in-flight connectivity (IFC) terminals, Onyx, with SCOTTY Group Austria GmbH (“SCOTTY”), a leading manufacturer and integrator of communication solutions, including in-flight connectivity for aircraft.

Solder Chemistry to Participate in the Fraunhofer Future Packaging Production Line at SMTconnect

05/22/2024 | Solder Chemistry
Solder Chemistry, a trusted brand for over 30 years now powered by Indium Corporation, will feature its complete suite of services for PCBA as part of the prestigious Fraunhofer Future Packaging Production Line exhibition at SMTconnect, June 11-13, in Nuremberg, Germany.

Curtiss-Wright Selected to Provide U.S. Air Force with Encrypted Tactical Networking Technology for Theater Deployable Communications

05/22/2024 | Curtiss-Wright Corporation
Curtiss-Wright Corporation announced it has been awarded a $16 million contract by Iron Bow, acting as the prime contractor, to provide the U.S. Air Force (USAF) with an integrated solution that provides optimization and improvement for deployable communications.
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