-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSilicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
Cost Drivers
In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
Mechatronics
Our expert contributors discuss the advent of mechatronics in PCB design, the challenges and opportunities this creates for circuit board designers, and the benefits—to the employee and the company—of becoming a mechatronics engineer.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Breaking High-speed Material Constraints: Design007 Magazine — May 2024
May 14, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
![](https://iconnect007.com/application/files/3817/1566/8177/Design007-0524-300.jpg)
The world of PCB materials used to be a fairly simple one. It was divided into two groups: the “traditional” laminates and the high-speed laminates developed especially for high-speed PCBs.
But then traditional laminates started getting better, and high-speed designers and design engineers took notice. The resin systems have improved to the point that designers are now using flavors of FR-4 for some high-speed PCBs, saving time and money, while streamlining the fab process. In this issue of Design007 Magazine, our contributors explain how to avoid overconstraining your materials when working with high-speed boards. Don’t miss it.
Suggested Items
The Chemical Connection: Chemical and Equipment Control of High-density Circuits, Part 2
08/27/2024 | Don Ball -- Column: The Chemical ConnectionIn my June column, I discussed how much control was needed for high-density circuits rather than what was thought necessary. I concentrated on cupric chloride and alkaline etch issues and equipment, since the etching step in the circuit board manufacturing process is one of the most critical areas where small changes in etchant parameters can have a large effect on the final product. The intention was to continue in the July issue with less critical process steps, such as developing and stripping. However, I got distracted by a specific control issue for alkaline etch, specifically controlling your alkaline etch process when you’re not etching a lot of copper. So, this month, I’m picking up where I left off in June.
Beyond Design: Does Current Deliver the Energy in a Circuit?
07/25/2024 | Barry Olney -- Column: Beyond DesignIn circuit theory, we learn that current flows in a closed loop, returning to the source via a conductor pair. This flow of current provides power to the load, and energy transfer occurs as described by Ohm’s law (P = VI). Conversely, in electromagnetics theory, we discover that current does not provide the power in a circuit, but rather the energy wave is guided by the conductor to power the load, according to Maxwell’s equations.
TRI Brings High-Speed Line Inspection at the SMTA Guadalajara 2024
07/24/2024 | TRITest Research, Inc. (TRI) will join the SMTA Guadalajara Expo 2024 to showcase our award-winning Inspection solutions for the SMT industry. Visit booth #1018 at the SMTA Expo Guadalajara from September 11 to 12, 2024, to experience the latest test and inspection innovations for the Electronics Manufacturing Industry.
Ansys Works with Supermicro and NVIDIA to Deliver Unmatched Multiphysics Simulation with Turnkey Hardware
07/19/2024 | ANSYSAnsys is collaborating with Supermicro and NVIDIA to deliver turnkey hardware, enabling unmatched acceleration for Ansys multiphysics simulation solutions.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/14/2024 | Nolan Johnson, PCB007This week’s must-reads are comprised of news which moves the industry forward. We’ve had quite a lot of news on a global scale, and they’re all good reads. To winnow down to just five, I chose either new information or interesting takes on ongoing industry stories. To that end, we have news about new capital equipment for advanced packaging, discussions of material selection and the imaging process during PCB fabrication, a columnist's ode to the best engineer she knows, and some optimistic news from the semiconductor industry.