-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueTraining New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Breaking High-speed Material Constraints: Design007 Magazine — May 2024
May 14, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

The world of PCB materials used to be a fairly simple one. It was divided into two groups: the “traditional” laminates and the high-speed laminates developed especially for high-speed PCBs.
But then traditional laminates started getting better, and high-speed designers and design engineers took notice. The resin systems have improved to the point that designers are now using flavors of FR-4 for some high-speed PCBs, saving time and money, while streamlining the fab process. In this issue of Design007 Magazine, our contributors explain how to avoid overconstraining your materials when working with high-speed boards. Don’t miss it.
Suggested Items
UHDI Fundamentals: UHDI Bleeding-edge Entertainment Applications, Part 2
02/06/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is revolutionizing bleeding-edge entertainment applications by enabling compact, high-performance devices that push the boundaries of immersion, interactivity, and realism. Part 2 focuses on how UHDI is advancing the entertainment industry, particularly gaming.
EXTOLL Collaborates with BeammWave and GlobalFoundries as Key SerDes IP Partner for Lowest Power High-Speed ASIC
02/04/2025 | GlobalFoundriesEXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX®.
Swissbit Unveils PCIe Gen4 SSD A1200
02/04/2025 | SwissbitSwissbit introduces the latest addition to its PCIe portfolio, the new A1200. The PCIe Gen4 M.2 SSD is designed to meet the demands of high-performance, mission-critical applications, focusing on consistent performance, low latency, and data integrity.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
01/24/2025 | Andy Shaughnessy, Design007This week’s round-up includes a variety of valuable articles, columns, and news items, focusing on the future of the industry, global markets, and more. Don’t forget to peruse our latest book, The Printed Circuit Designer’s Guide to... More Secrets of High-Speed PCBs, by Martyn Gaudion of Polar Instruments. I hope to see you at DesignCon!
I-Connect007 Releases The Printed Circuit Designer’s Guide to... More Secrets of High-Speed PCBs by Martyn Gaudion
01/29/2025 | I-Connect007I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to... More Secrets of High-Speed PCBs, authored by Martyn Gaudion of Polar Instruments. This invaluable resource offers essential insights for anyone involved in the design, procurement, or fabrication of high-speed impedance or insertion loss-controlled PCBs, as well as complex HDI PCBs requiring precise documentation.