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Inmarsat Launches NexusWave: A Game-Changing ‘Bonded’ Network Service For Maritime Communications

05/20/2024 | Inmarsat
Inmarsat Maritime, a Viasat company, has launched NexusWave, a fully managed connectivity service underpinned by a ‘bonded’ multi-dimensional network, offering high-speed connectivity, unlimited data, global coverage, and ‘secure by design’ infrastructure.

The Shaughnessy Report: Unlock Your High-speed Material Constraints

05/15/2024 | Andy Shaughnessy -- Column: The Shaughnessy Report
The world of PCB materials used to be a fairly simple one. It was divided into two groups: the “traditional” laminates, often called FR-4, and the high-speed laminates developed especially for high-speed PCBs. These were two worlds that usually didn’t collide. But then traditional laminates started getting better, and high-speed designers and design engineers took notice and started to reconsider what FR-4 could be used for.

Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products

05/01/2024 | Real Time with...IPC APEX EXPO
Chris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.

Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products

04/24/2024 | Siemens Digital Industries Software
Siemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.

Real Time with... IPC APEX EXPO 2024: Advancements in Laser Depaneling with LPKF

04/24/2024 | Real Time with...IPC APEX EXPO
Jake Benz, LPKF sales manager for North America, discusses the company's advancements in laser depaneling. LPKF has introduced a green wavelength laser for processing rigid FR-4 circuit boards, bringing significant gains in processing speeds to market. The company transitioned from IR CO2 to UV wavelength due to heat and burning issues.
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