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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Breaking High-speed Material Constraints: Design007 Magazine — May 2024
May 14, 2024 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
The world of PCB materials used to be a fairly simple one. It was divided into two groups: the “traditional” laminates and the high-speed laminates developed especially for high-speed PCBs.
But then traditional laminates started getting better, and high-speed designers and design engineers took notice. The resin systems have improved to the point that designers are now using flavors of FR-4 for some high-speed PCBs, saving time and money, while streamlining the fab process. In this issue of Design007 Magazine, our contributors explain how to avoid overconstraining your materials when working with high-speed boards. Don’t miss it.
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GreenSource Fabrication to Exhibit at PCB East 2026
04/23/2026 | GreenSource FabricationGreenSource Fabrication, the N. American industry’s most advanced, state-of-the-art printed circuit board manufacturer, today announced that it will be exhibiting at PCB East 2026, on Wednesday April 29,2026 at the DCU Convention Center 50 Foster Street in Worcester, MA.
Fincantieri to Build Spectre, a New Class of High-Speed Unmanned Surface Vessel
04/21/2026 | BUSINESS WIREFincantieri, through its U.S. subsidiary Fincantieri Marine Group (FMG), will build Spectre, a new class of high-speed, multi-mission unmanned surface vessel (USV), developed by Saildrone, a global leader and the world’s most experienced operator of unmanned surface vehicles.
Honeywell Aerospace, Defense Department Sign Deal to Boost Defense Tech Production
03/27/2026 | PRNewswireHoneywell announced it has signed a groundbreaking supplier framework agreement with the U.S. Department of War (DoW) to rapidly increase the production of critical defense technologies. This agreement includes a $500 million multi-year investment to upgrade the company's production capacity.
Wolfspeed Launches Next-Gen AI Data Center Packaging with 300mm SiC Technology
03/26/2026 | WolfspeedWolfspeed, Inc. , a global leader in silicon carbide technology, announced that its 300 mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade.
Dan’s Biz Bookshelf: 'Breakneck: China’s Quest to Engineer the Future'
03/26/2026 | Dan Beaulieu -- Column: Dan's Biz BookshelfEvery once in a while, a book comes along that doesn’t just inform you, it recalibrates you. Breakneck: China’s Quest to Engineer the Future by Dan Wang is one of those books. This is not another breathless “China is coming” warning, nor is it a dismissive “they’ll never catch up” comfort read. Wang does something far more valuable: He calmly, intelligently, and relentlessly walks you through what’s actually happening on the ground inside the world’s fastest industrial transformation. It’s eye-opening.