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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Listen Up: Popular Podcast Series Returns With Discussion of Electroless Copper
May 16, 2024 | I-Connect007Estimated reading time: Less than a minute
In the latest episode of the podcast series, On the Line With: Designing for Reality, Nolan Johnson returns to Sunstone Circuits in Mulino, OR, to continue down the manufacturing process with Matt Stevenson.
Now it's time to start getting into the chemistry! In episode 6, Matt Stevenson describes the first key step in turning design data into physical reality—preparing the circuit board substrate material for fabrication. It's not as straightforward as you might think.
This series is all about the specifics that can affect your circuit board during the manufacturing process and includes tips and tricks for optimizing design, fabrication, yields, and cost.
I-Connect007 is committed to providing digital content that meets the needs of the electronics industry, including magazines, books, newsletters, market reports, podcasts, and event coverage. As the industry's longest-running digital media company, I-Connect007 is a leading publisher of original content for the global electronics industry.
Listen now and be sure to visit our educational resource center to access more free content.
Suggested Items
New Information Now Available for Popular Podcast Series on PCB Design
10/24/2024 | I-Connect007Exciting news for listeners of On the Line With... PCB 3.0: A New Design Methodology, the popular podcast series hosted by I-Connect007. A 10-page companion guide featuring insights from Cadence's subject matter experts is now available for download.
I-Connect007 Launches Latest Podcast Series: Meet the Author
10/09/2024 | I-Connect007In the first episode of our Meet the Author series, SMT007 Magazine’s Nolan Johnson hosts Julie Cliche-Dubois, product manager at Cogiscan, and Andres Luna, general manager at Univertools, who represents Cogiscan in Mexico. Julie is the author of the recently published book, "The Printed Circuit Assembler's Guide to... Factory Analytics.” In this episode, the group discusses the evolving role of data analytics, with an eye toward how analytics is driving meaningful action throughout the electronics manufacturing industry in Mexico and the rest of the Americas.
Surface Finish: Tune in to the Latest Podcast Episode of On the Line with… ASC Sunstone
09/04/2024 | I-Connect007Don't miss the latest episode of "On the Line with… ASC Sunstone: Designing for Reality," in which ASC Sunstone’s General Manager, Matt Stevenson, discusses the critical topic of surface finishes in PCB manufacturing.
Indium Awards Silver Quill Honor to Authors of Cutting-Edge Technical Content
08/08/2024 | Indium CorporationIndium Corporation has honored nine of its employees for their technical industry contributions with its annual Silver Quill Award. While the company’s thought leaders present technical content at industry events throughout the year, Silver Quill provides special recognition to the most innovative and cutting-edge papers.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 3
08/07/2024 | I-Connect007 Editorial TeamIn this chapter, readers learn about the use of HRL3 alloy in solder joints to balance strength and ductility. Test results show improved performance with HRL3 alloy compared to traditional low-temperature solders.