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Siemens Debuts Fast, Accurate and Context-aware Electrostatic Discharge Verification Solution Spanning all Phases of IC Design

06/26/2024 | Siemens
Siemens Digital Industries Software announced today a fully automated solution to help integrated circuit (IC) design teams rapidly identify and address Electrostatic Discharge (ESD) issues driven by the growing complexity of today’s next-generation IC designs, regardless of targeted process technology.

Ansys Multiphysics Signoff Solutions Certified for Samsung’s 2nm Power Backside Delivery Technology

06/26/2024 | ANSYS
Ansys power integrity solutions have been certified by Samsung Foundry for use with Samsung’s new SF2Z 2nm gate-all-around manufacturing technology.

Cadence Expands System IP Portfolio with Network on Chip to Optimize Electronic System Connectivity

06/26/2024 | Cadence Design Systems, Inc.
The Cadence Janus NoC manages these simultaneous high-speed communications efficiently with minimal latency, enabling customers to achieve their PPA targets faster and with lower risk.

Space Engine Systems Announces Partnership With ASEI (USA) to Develop Hypersonic Solutions for Missiles

06/26/2024 | BUSINESS WIRE
Space Engine Systems (SES), following on its success in securing a place in UK MoD’s Hypersonic Technology and Capability Development Framework (HTCDF), is pleased to announce a partnership with Applied Systems Engineering Inc (ASEI) of the US.

Altair Announces Material Collaboration with HP

06/25/2024 | Altair
The collaboration will help break down traditional barriers to 3D printing adoption and ultimately help customers better design parts for Multi Jet Fusion and Metal Jet printers.
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