Beyond Design: AI-driven Inverse Stackup Optimization
Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
Real Time with… IPC APEX EXPO 2024: Unveiling the New Chief Strategist of Advanced Packaging at IPC
May 21, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Devan Iyer, IPC's new chief strategist of advanced packaging, shares his industry experience and the objectives of his role and emphasizes the necessity for solid standards and guidelines for new packaging technologies and design methodologies. He also highlights the significance of diverse package technologies across different markets. Devan is looking forward to collaborating with IPC and industry members as they find ways to connect emerging package technologies with PCB/EMS systems.
Click to watch the interview on our Real Time with... IPC APEX EXPO 2024 event site.
Share on:
Suggested Items
EdgeCortix Joins AI-RAN Alliance to Accelerate the Integration of AI and Next-gen RAN Infrastructure
12/20/2024 | EdgeCortixEdgeCortix, a leading fabless semiconductor company specializing in power-efficient AI processing, today announced its membership in the AI-RAN Alliance.
GlobalFoundries Sets New Bar as Largest Semiconductor Company to Protect Innovation by Joining LOT Network
12/19/2024 | GlobalFoundriesGlobalFoundries (Nasdaq: GFS) (GF) and LOT Network announced that GF has joined the LOT Network, the world’s largest patent licensing platform and non-profit community of global companies committed to protecting themselves against costly litigation from patent assertion entities (PAEs). With this move, GF joins a community of more than 4,500 companies that include half of the top 20 largest U.S. patent holders, and half of the S&P Global 100 and Fortune 100.
SEMICON Korea 2025 to Spotlight Edge Technologies Shaping the AI Era
12/18/2024 | SEMISEMICON Korea 2025 will take place Feb. 19-21 in Seoul at the COEX offering a comprehensive look into AI-driven technological advancements and edge technologies poised to shape the future of the global semiconductor industry. Themed
Honeywell, Sino Jet Expand Collaboration With New Memorandum Of Understanding
12/17/2024 | HoneywellHoneywell announced that it has signed a memorandum of understanding (MoU) with Sino Jet at the Middle East and North Africa Business Aviation Association (MEBAA) show.
Toray Engineering Launches TRENG-PLP Coater: Panel Level Coater for Advanced Semiconductor Packaging
12/17/2024 | ACCESSWIREToray Engineering Co., Ltd. has developed the TRENG-PLP Coater, a high-accuracy coating device for panel level packaging PLP is an advanced semiconductor packaging technology, for which there is growing demand particularly from AI servers and data centers. Sales of the TRENG-PLP Coater will commence in December 2024.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in