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Taking Standards and Industry Into a Future Age
May 24, 2024 | Chris Jorgensen, IPCEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/2317/1644/5082/Chris_Jorgensen_300.jpg)
IPC APEX EXPO 2024 proved to be another busy week in the world of IPC Factory of the Future standards development. It would be near impossible to cover every last nook and cranny of important discussions, outcomes, and future-looking plans that occurred during our Factory of the Future standards committee meetings, but we will do our best to provide a textual highlight reel for the week.
All the standards activities mentioned here are open for involvement by anyone. There is no IPC membership required or cost to participate. Our committees and A-Teams are simply looking for like-minded people who will roll up their sleeves and work with colleagues from around the world to advance these standards. Click here to sign up.
A Hermes Group is Born
APEX EXPO was host to the first-ever meeting of the IPC Hermes Standard Task Group. That’s right, we now have a task group for closer collaboration with The Hermes Standard Initiative members on the ongoing development of IPC-HERMES-9852, The Global Standard for Machine-to-Machine Communication in SMT Assembly.
The Hermes Standard Initiative and IPC formed this task group to give Hermes users on their shop floors a seat at the table and a voice in the ongoing development of the standard. This is an important step forward as Hermes utilization increases, especially in facilities that also utilize IPC-CFX.
During the meeting, attendees learned that IPC-HERMES-9852, Version 1.6 had recently cleared Final Draft for Industry Review (FDIR) and subsequent unanimous vote by the Hermes Standard Initiative members. The standard is now under vote by an IPC ballot group with publication planned for later this spring.
Even though Version 1.6 may be wrapping up, the Hermes Messengers A-Team is already getting to work on enhancements for Version 1.7.
To read the rest of this article, which appeared in Real Time with... IPC APEX EXPO 2024 Show & Tell Magazine, click here.
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Give Yourself an Edge at the IPC High Reliability Forum 2024
08/27/2024 | Marcy LaRont, PCB007 MagazineFor those who support military and defense products, few topics are more important than reliability, particularly as we venture into complex packaging requirements that accommodate next-gen chips and electronic systems. Recently, I visited with Teresa Rowe, IPC senior director, assembly and standards technology, to discuss the IPC High Reliability Forum (HRF), Oct. 9-10, at the McKimmon Center, in Raleigh, North Carolina. With topics that cover high-voltage electronics, standardized test methods, and assembly and solder joint X-ray challenges, it is clear that this event needs to be included on your annual conference calendar.