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Ansys to Demonstrate 3D Multiphysics Visualization of Electromagnetic and Thermal Effects in Semiconductor Packages at Design Automation Conference

06/20/2024 | ANSYS
Ansys announced that it is adopting NVIDIA Omniverse application programming interfaces (APIs) to offer 3D-IC designers valuable insights from Ansys’ physics solver results through real-time visualization. Ansys announced that it is adopting NVIDIA Omniverse application programming interfaces (APIs) to offer 3D-IC designers valuable insights from Ansys’ physics solver results through real-time visualization.

Ansys’ Collaboration with Schrödinger will Accelerate Materials Development with Unprecedented Multiscale Simulation

05/09/2024 | ANSYS
Ansys and Schrödinger are collaborating to deliver an ICME approach that bridges the gap between materials discovery and product development.

Ansys Announces Q1 Financial Results

05/03/2024 | ANSYS
ANSYS, Inc. reported first quarter 2024 revenue of $466.6 million, a decrease of 8% in reported and constant currency, when compared to the first quarter of 2023.

TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips

04/30/2024 | PRNewswire
Ansys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.

Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems

04/25/2024 | PRNewswire
Ansys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
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