Ansys Semiconductor Solutions Certified by TSMC for Reliable, Accurate Analysis of Evolving Chip Designs

Estimated reading time: 1 minute

Ansys announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC's N2 silicon process technology. PathFinder-SC delivers a novel verification solution that provides superior capacity and performance, easily accommodating large designs in the cloud. This solution presents new opportunities to perform robust ESD analysis for P2P and CD — both earlier in the design process and at end stage ESD validation — for large, complex designs including System-on-Chip and multi-die integrated circuits. This ensures chips are protected from electrical overstress, delivering safe and reliable semiconductor products for applications including AI, high-performance computing (HPC), 5G mobile communications, automotive, memory, and graphic processors (GPUs).

To promote the cloud as a high-capacity, high-speed option for mutual customers, Ansys and TSMC collaborated to complete certification for SeaScape that includes RedHawk-SC, PathFinder-SC, and RedHawk-SC Electrothermal 3D-IC multiphysics analysis platform. Ansys Totem solution for transistor-level and mixed-signal design is also certified, delivering customers the same verification reliability and accuracy when running projects in a distributed cloud environment.

"As the scale and size of chips continues to increase, we need to consider new approaches and new technologies that ensure our customers have access to optimal design solutions that maximize the performance and power efficiency of our cutting-edge process technologies," said Lipen Yuan, senior director of advanced technology business development at TSMC. "Our collaboration with Open Innovation Platform® (OIP) partners like Ansys delivers a proven, reliable verification solution for customers advancing the forefront of semiconductor design."

"The Ansys multiphysics platform continues to prove itself a strong technical solution for a range of physics, from power integrity to high-speed electromagnetics," said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. "Our collaboration with TSMC extends multiphysics analysis for joint customers that are designing some of the most complex chips in the world and looking to take advantage of the cloud to accelerate their productivity."