Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

Infineon, Lenovo Partner to Power Next-Generation Software-Defined Vehicles

01/05/2026 | Infineon
Infineon Technologies AG, the world leader in power systems and automotive microcontrollers (MCUs), and Lenovo, a global technology powerhouse, are intensifying their collaboration to accelerate the next level of autonomous driving.

I-Connect007 Editor's Choice: Five Most-Read Articles for 2025

01/02/2026 | Michelle Te, I-Connect007
Happy New Year! As we begin 2026, I would like to pause and reflect on our most-read articles from 2025. They give us insight into what you’re focused on, and what you’re trying to understand, prepare for, and improve. Each piece earned its place through relevance, depth, and sustained reader engagement.

Department of War Invests $32.7M to Accelerate Solid Rocket Motor Component Production

12/30/2025 | U.S. Department of War
The Department of War announced today two September 30, 2025, Defense Production Act (DPA) Title III investments totaling $32.7 million to expand the solid rocket motor (SRM) industrial base.

Cutting Through the Noise in Component Sourcing

12/29/2025 | Brittany Martin, I-Connect007
Every engineer knows the pain of searching for parts—it’s often slow, frustrating, and outdated, more like flipping through a phone book than using modern technology. Despite decades of progress in electronics, component sourcing remains one of the industry’s most tedious and time-consuming tasks.

Revolutionizing PCB Manufacturing in the AI Era

12/22/2025 | Marcy LaRont, PCB007 Magazine
Artificial intelligence is reshaping every corner of the electronics ecosystem, and PCB manufacturing is under unprecedented pressure to evolve. In this exclusive conversation, Li Zhiqiang, general manager of Zhuhai Henger Microelectronics Equipment Co., Ltd., explains how plasma technology is emerging as a linchpin for next-generation AI hardware. As AI servers demand increasingly dense, high-performance PCBs, traditional chemical processes struggle to keep pace with new material systems and tighter reliability requirements.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in