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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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A Memorial Day Holiday Notice
May 27, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: 1 minute
Today is Memorial Day, a federal holiday in the United States. As we celebrate Memorial Day, we are reminded of the sacrifice of American soldiers—from the Revolutionary War to Vietnam, from Korea to the War on Terror.
As professionals in electronics manufacturing, we are grateful for our men and women in uniform and the essential functions they perform. To all of those who have served, and especially to our brothers and sisters in uniform who have given their lives in the defense of the United States of America, we thank you. Your sacrifice is not forgotten.
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Cyberattack via Ransomware at Major EMS Provider Foxconn
05/15/2026 | I-Connect007 Editorial TeamA recent cyberattack targeting Foxconn has once again exposed the growing vulnerability of global manufacturing and electronics supply chains to ransomware operations. According to CyberScoop, the attack disrupted operations at several of Foxconn’s North American facilities, temporarily forcing some production activities into manual workarounds while systems were restored.
Siemens Expands EDA Software Access Through EuroCDP Project
05/14/2026 | SiemensSiemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.
Three Howard University Engineers Launch Trace to Automate PCB Design Workflows
05/12/2026 | Globe NewswireTrace, an AI software company automating the printed circuit board (PCB) design workflow, has launched out of stealth and is now accepting customers worldwide.
US Air Force Selects L3Harris for Advanced Battle Management Digital Network
05/11/2026 | L3Harris TechnologiesL3Harris Technologies has been selected to develop key features of the secure and resilient digital infrastructure that will serve as the backbone of the U.S. Air Force’s command and control network.
Renesas Completes Acquisition of Irida Labs
05/07/2026 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that a subsidiary of Renesas has completed the acquisition of Irida Labs, a Greece-based company specializing in embedded software for AI-powered visual perception systems.