Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch
Target Condition: Designing vs. Inventing
Dana on Data: The Missing AI-NPI Link
Best Student Poster: Drop Shock Reliability
May 29, 2024 | Michelle Te, I-Connect007Estimated reading time: 1 minute
Two Auburn University doctoral candidates authored a poster on drop shock performance of solder alloys in BGA assemblies that won Best Student Poster at IPC APEX EXPO 2024. They received a $750 cash prize and a $2,000 scholarship.
Palash Vyas is a Ph.D. candidate in the Department of Industrial Engineering with more than three years of research experience in reliability testing of PCBs. His paper was co-authored by Soroosh Alavi, who has bachelor’s and master’s of science degrees in industrial engineering and is now in his third year as a doctoral student in industrial and systems engineering, while also working on a master’s degree in data science.
Both students are well-known to the IPC Education Foundation. Palash is a former president of the IPC Student Chapter at Auburn University. He also won Best Student Paper in 2022 for solder joint reliability during thermal cycling. Soroosh joined his IPC Student Chapter at Auburn in 2022. Both have won member and leadership scholarships over the past four years.
Of their 2024 poster, the judges noted that “the research is very novel” and “there is not a lot of research in this area of drop shock test of PCBs at elevated temperatures.” The judges said Palash and Soroosh have a good understanding of the subject matter.
Julia Flynn, IPC professional development coordinator, said the Technical Program Committee members who reviewed their poster “were impressed,” and gave them high scores all around for the technical content.
“I am deeply honored to have received the Best Poster Award,” Palash said. “Apart from alleviating the financial burden of tuition, the award will help strengthen my belief in my potential to make a difference in the electronics industry. It will greatly boost my motivation as a researcher.”
“The award is deeply meaningful to me,” Soroosh said. “It validates the hard work and dedication I’ve invested in my research and reassures me that my contributions are valuable to the field. This recognition not only motivates me to continue pushing the boundaries of what I can achieve but also reinforces my commitment to making impactful advancements in the industry.”
To read this entire article, which appeared in the 2024 issue of Show & Tell Magazine, click here.
Share on:
Suggested Items
TRI Test Solutions at INNOELECTRO 2025
04/02/2025 | TRIAnytest will join INNOELECTRO 2025, held at BOK Sportcsarnok from April 8 – 10, 2025, to showcase TRI's Test Solution.
IPC APEX EXPO 2025 Review: Shifting My Focus to the Show Floor
04/02/2025 | John Watson, CIDIPC APEX EXPO 2025 marked a significant milestone as it celebrated its 25th anniversary. (Personally, I don’t think it looked a day over 20.) If you didn’t attend this great event, why not? This was my 10th anniversary of attending, and it had a distinctly different feel. There was a celebratory atmosphere as both veterans, like myself, and first-time attendees, were drawn into a celebratory occasion marking the significant milestone of the 25th anniversary.
European Chips Skills Academy Launches ECS Summer School 2025 to Inspire Future Electronics Talent
04/01/2025 | JCN NewswireThe European Chips Skills Academy (ECSA), an EU-funded project coordinated by SEMI Europe, in collaboration with industry partners AENEAS, EPoSS, and INSIDE, has announced the launch of the ECS Summer School 2025.
Real Time with... IPC APEX EXPO 2025: Highlighting Global PCB Trends and Technologies with all4-PCB
04/01/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy and all4-PCB's Ralph Jacobo discuss global distribution trends in the PCB industry, focusing on new technologies in plasma etching and final inspection. Ralph highlights the importance of IC substrate buildup technology and partnerships in the market.
Do You Have X-ray Vision? SMT007 Magazine April Issue Is No Joke
04/01/2025 | I-Connect007 Editorial TeamAs component packaging continues to evolve, the capability of inspecting through components is crucial. Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question—and others—to bring more efficiency to your bottom line.