Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
Target Condition: Rethinking the PCB Stackup Recipe
Connect the Dots: Evolution of PCB Manufacturing—Lamination
Best Student Poster: Drop Shock Reliability
May 29, 2024 | Michelle Te, I-Connect007Estimated reading time: 1 minute
Two Auburn University doctoral candidates authored a poster on drop shock performance of solder alloys in BGA assemblies that won Best Student Poster at IPC APEX EXPO 2024. They received a $750 cash prize and a $2,000 scholarship.
Palash Vyas is a Ph.D. candidate in the Department of Industrial Engineering with more than three years of research experience in reliability testing of PCBs. His paper was co-authored by Soroosh Alavi, who has bachelor’s and master’s of science degrees in industrial engineering and is now in his third year as a doctoral student in industrial and systems engineering, while also working on a master’s degree in data science.
Both students are well-known to the IPC Education Foundation. Palash is a former president of the IPC Student Chapter at Auburn University. He also won Best Student Paper in 2022 for solder joint reliability during thermal cycling. Soroosh joined his IPC Student Chapter at Auburn in 2022. Both have won member and leadership scholarships over the past four years.
Of their 2024 poster, the judges noted that “the research is very novel” and “there is not a lot of research in this area of drop shock test of PCBs at elevated temperatures.” The judges said Palash and Soroosh have a good understanding of the subject matter.
Julia Flynn, IPC professional development coordinator, said the Technical Program Committee members who reviewed their poster “were impressed,” and gave them high scores all around for the technical content.
“I am deeply honored to have received the Best Poster Award,” Palash said. “Apart from alleviating the financial burden of tuition, the award will help strengthen my belief in my potential to make a difference in the electronics industry. It will greatly boost my motivation as a researcher.”
“The award is deeply meaningful to me,” Soroosh said. “It validates the hard work and dedication I’ve invested in my research and reassures me that my contributions are valuable to the field. This recognition not only motivates me to continue pushing the boundaries of what I can achieve but also reinforces my commitment to making impactful advancements in the industry.”
To read this entire article, which appeared in the 2024 issue of Show & Tell Magazine, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Datest Marches Into SMTA International with Backup Plans, Big Partnerships, and Bigger X-rays
10/06/2025 | DatestDatest, the industry’s favorite second set of eyes (and hands, and solder joints), is heading to SMTA International 2025 at the Donald E. Stephens Convention Center in Rosemont, IL. Find us at Booth #2627, where high-reliability, high-complexity builds meet their match.
Imec’s New GeSi Modulator Hits 400Gb/s, Paving the Way for Next-Gen Optical Interconnects
10/02/2025 | ImecImec – a world-leading research and innovation hub in nanoelectronics and digital technologies – today announced the successful demonstration of a beyond-110GHz C-band GeSi electro-absorption modulator, fabricated on its 300mm silicon photonics platform.
New Podcast Episode: How Does UHDI Benefit SWaP?
10/03/2025 | I-Connect007In podcast episode 4, “SWaP Considerations,” host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.
October 2025 SMT007 Magazine: Upgrading Your Production Software
10/01/2025 | I-Connect007 Editorial TeamEMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone? The October 2025 issue of SMT007 Magazine investigates business operations software and how best to achieve the necessary integrations.
Federal Electronics Successfully Completes AS9100 and ISO 9001 Surveillance Audit at Cranston Headquarters
09/30/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, announced the successful completion of its annual AS9100 and ISO 9001 surveillance audit at its headquarters in Cranston, Rhode Island.